
Samsung Electronics is reportedly developing a new advanced packaging technology for its upcoming mobile application processor (AP), the Exynos 2600, according to ZDNET Korea. This innovation aims to integrate heat-dissipating materials directly within the semiconductor package, potentially enhancing the performance of next year’s Galaxy S26 smartphone series. Continue reading “Samsung Exynos 2600 2nm SoC could get Heat Pass Block”









OPPO has confirmed the launch of K13 Turbo series in India, after it was 



