MediaTek and JioThings announced the launch of the “Made in India” Smart Digital Cluster and Smart Module for the 2-wheeler market. This collaboration combines MediaTek’s chipset technology with JioThings’ digital solutions to enhance the 2-wheeler and EV sectors. Continue reading “JioThings and MediaTek introduce 4G smart Android cluster and module for two-wheeler EVs”
Earlier this year, Samsung introduced the industry’s first LPDDR5X DRAM, supporting the highest performance of up to 10.7 gigabits-per-second (Gbps). Continue reading “Samsung completes validation of 10.7Gbps LPDDR5X RAM on upcoming Dimensity 9400 SoC”
Ahead of its COMPUTEX 2024 MediaTek has introduced Kompanio 838 SoC for premium Chromebooks, and the Pentonic 800 SoC for 4K premium smart TVs and displays. Continue reading “MediaTek Kompanio 838 and Pentonic 800 chipsets announced”
MediaTek has introduced Dimensity 7300, another 7000 series chipset, as the successor to last year’s Dimensity 7050. There is also Dimensity 7300X designed for flip-style foldable devices with support for dual displays. Continue reading “MediaTek Dimensity 7300 and Dimensity 7300X 4nm SoCs announced”
MediaTek introduced the Dimensity 9300+ SoC at its MediaTek Dimensity Developer Conference (MDDC) 2024. At the event, the company also mentioned the Dimensity 8250 SoC as the toned down version of the Dimensity 8300 SoC. Continue reading “OPPO Reno 12 said to be powered by Dimensity 8250 SoC”
MediaTek just announced the Dimensity 9300+ as the upgraded version of the Dimensity 9300 at the MediaTek Dimensity Developer Conference (MDDC) 2024, as it had promised. Continue reading “MediaTek Dimensity 9300+ official, to power vivo X100s series and iQOO Neo9s Pro”
MediaTek has confirmed the launch of Dimensity 9300+ as the successor of the Dimensity 9300 in China at the MediaTek Dimensity Developer Conference (MDDC) 2024 on May 7th. Continue reading “MediaTek Dimensity 9300+ to be announced on May 7”
MediaTek is preparing to launch its latest 3nm chipset, the Dimensity 9400, which could incorporate ARM’s newest CPU architecture, ‘BlackHawk,’ for improved performance over chips like the A17 Pro and Qualcomm Oyron, as per tipster Digital Chat Station. Continue reading “MediaTek Dimensity 9400 with ARM ‘BlackHawk’ CPU architecture surfaces”
MediaTek has introduced Dimensity 6300 SoC in the Dimensity 6000 series after the launch of Dimensity 6100+ last year. It integrates an enhanced 5G modem supporting 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation and has MediaTek UltraSave 3.0+ technology for power saving, same as the 6100+. Continue reading “MediaTek Dimensity 6300 6nm 5G SoC announced”
MediaTek has silently introduced the Helio G91, an upgrade to Helio G88 SoC which was introduced 3 years back. This has support for up to 90Hz FHD+ display, same as the predecessor, but has support for up to 108MP main camera with in-sensor zoom, an upgrade from 64MP in the previous model. Continue reading “MediaTek Helio G91 with support for 90Hz FHD+ display, up to 108MP camera announced”
MediaTek has announced collaboration with Google to optimize Gemini Nano, Google’s innovative Large Language Model (LLM), for its flagship Dimensity 9300 and Dimensity 8300 chipsets. Continue reading “MediaTek and Google partner for on-device generative AI on Dimensity 9300 and 8300 SoCs”
Nothing today confirmed that the Nothing Phone (2a) will feature MediaTek Dimensity 7200 Pro SoC, which has been co-engineered with MediaTek to deliver the best performance with optimal power consumption. Continue reading “Nothing Phone (2a): Dimensity 7200 Pro, up to 12GB of RAM”
MediaTek is set to unveil its new Dimensity 9400 chipset in the fourth quarter of this year, according to a report from Chinese media. Continue reading “MediaTek Dimensity 9400 3nm SoC specs surface”
MediaTek just announced Dimensity 8300, the company’s latest 8000 series SoC for premium 5G smartphones, as the successor to Dimensity 8200. It uses second-generation TSMC’s 4nm process tech. Continue reading “MediaTek Dimensity 8300 4nm SoC official; Dimensity 8300-Ultra to power Redmi K70E”
MediaTek recently confirmed that it will introduce Dimensity 8300, successor to last year’s Dimensity 8200 on November 21st in China. Now the specifications of the phone has surfaced in the Geekbench 6 benchmark of the upcoming Redmi K70 phone with the model number Xiaomi 2311DRK48C. Continue reading “MediaTek Dimensity 8300 specs surface in Redmi K70 benchmark ahead of Nov 21 launch”
