MediaTek has announced the Filogic 8000 family at CES 2026. The chipset family is designed to support the upcoming Wi-Fi 8 standard and focuses on reliable, low-latency wireless connectivity across gateways and client devices, including AI-driven use cases. Continue reading “MediaTek Filogic 8000 Wi-Fi 8 chipset platform unveiled at CES 2026”
MediaTek has silently announced Dimensity 7100, its latest 5G chipset for next generation of mid-range 5G smartphones. It is built TSMC 6nm production process. The company said that it will be up to 5% more power‑efficient in apps, up to 23% more power‑efficient modem, up to 16% more power‑efficient multimedia playback compared to the predecessor. Continue reading “MediaTek Dimensity 7100 6nm SoC announced”
MediaTek just announced Dimensity 9500, the company’s latest flagship SoC, as the successor to Dimensity 9400 / 9400+ as it had announced. It uses third-generation TSMC’s 3nm process tech and the third-generation all-large core CPU architecture. Continue reading “MediaTek Dimensity 9500 3nm SoC official”
After rumours, MediaTek has confirmed the launch of the company’s next flagship chip at an event in China on September 22nd, which should be the Dimensity 9500. This is cheduled a day before Qualcomm unveils the Snapdragon 8 Elite Gen 5 flagship chip at the Snapdragon Summit. Continue reading “MediaTek Dimensity 9500 launch event set for September 22”
MediaTek introduced its latest premium 5G chipset, the Dimensity 8450, at the India Dimensity Summit. Leading brands such as OPPO, vivo, motorola, Redmi, realme, Infinix, Samsung, and Lava participated in the showcase. Continue reading “MediaTek launches Dimensity 8450 5G SoC at India Dimensity Summit”
MediaTek Dimensity 9500 has surfaced in Geekbench OpenCL benchmark for the first time, after rumours. This reveals that it will still be an Octa-core processor with 1 x Travis+3 x Alto+4 x Gelas architecture. Continue reading “MediaTek Dimensity 9500 surfaces in benchmarks”
MediaTek introduced the MediaTek Dimensity 9400e chipset earlier today. realme today confirmed that the realme GT 7 will be the first phone in the South Asia, Europe, Southeast Asia, Latin America, Middle East and North Africa, and other more regions to use the chip. Continue reading “realme GT 7 to be powered by MediaTek Dimensity 9400e”
At the OnePlus Game Strategic Communication Conference in China, MediaTek introduced its Dimensity 9400e processor, which is an enhanced version of last year’s Dimensity 9300+. Continue reading “MediaTek Dimensity 9400e official, to power OnePlus Ace5 Racing Edition”
MediaTek Dimensity 9400+ was introduced earlier this month, now the details about the upcoming flagship Dimensity 9500 processor has surfaced, thanks to leaker Digital Chat Station. Continue reading “MediaTek Dimensity 9500 details surface, 100TOPS NPU?”
MediaTek just announced the Dimensity 9400+ as the upgraded version of the Dimensity 9400 ahead of tomorrow’s MediaTek Dimensity Developer Conference (MDDC) 2025. Continue reading “MediaTek Dimensity 9400+ official: Faster CPU, NPU and better connectivity”
MediaTek launched the Kompanio Ultra 910 processor for Chromebook Plus laptops, featuring Agentic AI and high performance. The company states it powers “the highest performing Chromebooks yet, while also delivering all-day battery life.” Continue reading “MediaTek Kompanio Ultra 910 processor with On-Device AI for Chromebooks announced”
Google is reportedly preparing to partner with Taiwan’s MediaTek to develop its next-generation AI chips, known as Tensor Processing Units (TPUs), set to launch in 2026, according to The Information. Continue reading “Google eyeing MediaTek for AI TPU manufacturing: Report”
MediaTek has introduced Dimensity 7400, another 7000 series chipset, as the successor to last year’s Dimensity 7300. Similar to last year, there is also Dimensity 7400X designed for flip-style foldable devices with support for dual displays. Continue reading “MediaTek Dimensity 7400 and Dimensity 7400X announced”
MediaTek just announced the Dimensity 8400 as the successor to last year’s Dimensity 8300 SoC, as it had promised. This brings an All Big Core design to the premium smartphone market for the first time, said the company. Continue reading “MediaTek Dimensity 8400 SoC official; Dimensity 8400-Ultra to power Redmi Turbo 4”
MediaTek has scheduled an event on December 23rd in China to introduce its next generation Dimensity chip. The invite doesn’t reveal any other details, but based on rumours, it is expected to introduce the Dimensity 8400 SoC as the successor to Dimensity 8300 SoC. Continue reading “MediaTek to introduce next-gen Dimensity chip on December 23 — Dimensity 8400 expected”
