MediaTek has announced the Dimensity 9500s and Dimensity 8500 smartphone chipsets at its Tech Day event in Delhi after these were introduced last month for the global markets. The platforms target flagship and premium smartphone segments, focusing on performance, efficiency, on-device AI processing, imaging, gaming, and wireless connectivity. Both chipsets use an “All-Big Core” CPU architecture and support agentic AI workloads.
MediaTek Dimensity 9500s
The Dimensity 9500s is built on a 3nm process and features an octa-core All-Big Core CPU architecture. The CPU includes one Cortex-X925 ultra core clocked up to 3.73GHz, three Cortex-X4 premium cores, and four Cortex-A720 performance cores. Graphics are handled by the Immortalis-G925 GPU, and the integrated NPU supports generative reasoning and multi-modal AI models.
Key capabilities include:
- MediaTek Imagiq image signal processor supporting 8K full-focus Dolby Vision HDR video recording with real-time 30fps motion tracking
- Adaptive Game Technology 3.0 (MAGT 3.0) and frame technology 3.0 (MFRC 3.0) for energy-efficient gaming
- 5G Release-17 modem with 4CC carrier aggregation and peak downlink speeds up to 7Gbps
- MediaTek 5G UltraSave 4.0 power-saving technology
- AI Network Suite 2.0 for stable performance in weak connectivity
- MediaTek Xtra Range 3.0 for extended indoor Wi-Fi coverage
- Phone-to-phone Bluetooth direct connections up to five kilometres
Quick Specs
- CPU: Octa-core (1x Cortex-X925 up to 3.73GHz, 3x Cortex-X4, 4x Cortex-A720), 12MB L3 cache, 10MB SLC
- Memory: LPDDR5X, up to 10667 Mbps
- Storage: UFS 4 + MCQ
- 5G/4G: Multi-mode, 5G/4G/3G/2G, SA & NSA, 5G carrier aggregation
- 5G Downlink: Sub6 DL 4CC 300MHz, R17 Enhancement, LB DL 4×4 MIMO
- 5G Uplink: Sub6 UL 2CC 200MHz, R17 Enhancement, FDD UL 2×2 MIMO/PC2
- Power Saving: MediaTek UltraSave 4.0, R17 Power Saving Enhancement
- GNSS: GPS, BeiDou, Glonass, Galileo, QZSS, NavIC L5
- Wi-Fi: Wi-Fi 7 (a/b/g/n/ac/ax/be), Triple Band Triple Concurrency, peak 6.5 Gbps
- Bluetooth: 5.4
- Camera: Max sensor 320MP, 108MP @ 30fps, 3x 36MP @ 30fps; Max video 8K60
- GPU: Arm Immortalis-G925
- Video: 8K60 10-bit decode (HEVC/AVC/VP9/AV1), 8K30 10-bit encode (HEVC/AVC), 8K60 8-bit HEVC encode
- Display: WQHD+ up to 180Hz, Tri-port MIPI for Tri-Fold displays
- AI: MediaTek NPU supporting Generative AI and Agentic AI
MediaTek Dimensity 8500
The Dimensity 8500 uses a 4nm process and All-Big Core CPU architecture with eight Cortex-A725 cores clocked up to 3.4GHz. The computing and gaming engine supports stable frame delivery, faster loading, energy efficiency, and ray tracing for mainstream mobile games.
Key capabilities include:
- MediaTek 8th-generation NPU supporting mainstream large language and multi-modal models and on-device image generation
- AI ultra-clear telephoto algorithm for image processing
- Dimensity AI semantic engine for frame optimization
- Mali-G720 GPU with a 25% performance improvement over the previous generation
- Accurate workload scheduling
- Support for LPDDR5X memory speeds up to 9600Mbps
Quick Specs
- CPU: Octa-core (1x Cortex-A725 up to 3.4GHz, 3x Cortex-A725 up to 3.2GHz, 4x Cortex-A725 up to 2.2GHz), 6MB L3 cache, 5MB SLC
- Memory: LPDDR5X 4-channel, up to 9600 Mbps
- Storage: UFS 4 + MCQ
- 5G/4G: Multi-mode, 5G/4G/3G/2G, SA & NSA modes, 5G carrier aggregation
- Smart Network: Smart Network Suite 3.0, Subway Mode 2.0, DSDA 2.0
- 5G Downlink: FR1 LB DL 4×4 MIMO, 3CC up to 220 MHz
- 5G Uplink: 256QAM FR1 UL 2CC, FDD UL TxD
- Power Saving: MediaTek UltraSave 3.0+, R16 UL Enhancement
- GNSS: GPS, BeiDou, Glonass, Galileo, QZSS, NavIC L5
- Wi-Fi: Wi-Fi 6E (a/b/g/n/ac/ax), 2T2R
- Bluetooth: 5.4
- Camera: Max sensor 320MP, 3x 32MP @ 30fps; Max video 4K60
- GPU: Arm Mali-G720 MC8
- Video Encode/Playback: 4K @ 60FPS (H.264/AVC, H.265/HEVC, VP9, AV1)
- Display: WQHD+ up to 144Hz, dual screen support (dual DSI)
- AI: MediaTek NPU 880
Availability
MediaTek confirms that smartphones powered by the Dimensity 9500s and Dimensity 8500 will arrive through partner manufacturers. OPPO Find X9s in India is confirmed to be powered by the chip in India. POCO has also confirmed a device based on the chip in India soon, with additional announcements from other OEMs expected in the coming months.
Speaking on the launch, JC Hsu, Corporate Senior Vice President at MediaTek and General Manager of the Wireless Communications Business Unit, said:
As leaders in smartphone global share, we are committed to expanding our investment in advanced technologies and striving to make bleeding-edge products available to more people. This mission is evident in this pair of Dimensity chipsets, which are intended to provide more flagship and premium smartphone experiences while upholding our vision in bringing the best possible performance and power efficiency to more people.