MediaTek introduced its latest premium 5G chipset, the Dimensity 8450, at the India Dimensity Summit. Leading brands such as OPPO, vivo, motorola, Redmi, realme, Infinix, Samsung, and Lava participated in the showcase.
The event also celebrated one year of MediaTek Connect with a gaming tournament, while MediaTek showcased its complete 5G chipset portfolio—from flagship to entry-level.
MediaTek Dimensity 8450
Built on an All Big Core CPU with eight Arm Cortex-A725 cores and a Mali-G720 MC7 GPU, the Dimensity 8450 delivers up to 30% better performance and power efficiency, said the company.
The chip integrates the NPU 880 and Agentic AI Engine, supporting global generative AI models, LLMs, and advanced AI workloads.
A new Dual EIS Engine enables stabilized 4K60 HDR (HLG) video, while Live Broadcast Booster enhances face clarity during livestreams using 7% less power than traditional full-scene AI.
Gaming, Imaging, and Connectivity Upgrades
For imaging, the Imagiq 1080 ISP supports in-sensor zoom (QPD remozaic) with zero-lag HDR and 100% PDAF. With HyperEngine MAGT 3.0, gamers enjoy quicker touch responsiveness and more efficient 5G to Wi-Fi connectivity switching.
The chip supports WQHD+ resolution at 144Hz, dual screens, and fast 5G-A connectivity with up to 5.17Gbps and 3CC carrier aggregation, along with UltraSave 3.0+ for enhanced power efficiency.
Quick Specifications: MediaTek Dimensity 8450
- CPU: 8 x ARM Cortex-A725 cores (1x 1MB L2 + 3x 512KB L2 + 4x 256KB L2), 6MB L3 cache + 5MB SLC
- GPU: Arm Mali-G720 MC7
- AI: MediaTek NPU 880 (Generative AI, Agentic AI Engine)
- Process: 4nm process
- Display: WQHD+ up to 144Hz, dual screen support
- Camera: Up to 320MP sensor, Imagiq 1080 ISP with in-sensor zoom (QPD remozaic)
- Connectivity: 5G Sub-6GHz modem, 3CC Carrier Aggregation, up to 5.17 Gbps, Wi-Fi 6E (2T2R), Bluetooth 5.4
- Memory & Storage: LPDDR5X RAM up to 8533 Mbps, UFS 4.0 + MCQ storage
- Video: 4K60 HDR (HLG) capture with Dual EIS
- Gaming & Power: HyperEngine MAGT 3.0 (gaming enhancements), UltraSave 3.0+ power efficiency
Availability
In India, OPPO will be first to launch the Reno14 Pro with Dimensity 8450, followed by another K-series model soon.
Speaking at the event, Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business Unit, stated,
With the introduction of the MediaTek Dimensity 8450, we are broadening our range of advanced mobile platforms, offering device makers and users a greater variety of premium options. This chipset enables users to explore creativity through agentic AI and enhanced imaging, while also elevating mobile gaming experiences. Featuring our All Big Core architecture, which is also present in our flagship models, we prove that outstanding performance and power efficiency can go hand in hand, so consumers no longer have to compromise.