MediaTek showcases consumer-ready Wi-Fi 7 products at CES 2023

For the first time, MediaTek has announced that it will demonstrate a full ecosystem of production-ready devices featuring the next generation of wireless connectivity at CES 2023. Wi-Fi 7 employs a record-breaking 320 MHz channel bandwidth as well as 4096-QAM modulation. Continue reading “MediaTek showcases consumer-ready Wi-Fi 7 products at CES 2023”

MediaTek Dimensity 8200 4nm SoC official; to power iQOO Neo7 SE, Redmi K60E and more

After rumors, MediaTek has officially introduced the Dimensity 8200, the company’s latest SoC in the 8000 series, after a slight delay. The successor to the Dimensity 8100 uses 4nm-class process, offering improved power efficiency compared to 5nm. Continue reading “MediaTek Dimensity 8200 4nm SoC official; to power iQOO Neo7 SE, Redmi K60E and more”

Bullitt partners with MediaTek to launch world’s first smartphone with 2-way satellite messaging in Q1 2023

Bullitt Group, popular for its rugged CAT phones, already confirmed in September that it will launch the first smartphone to include a two-way satellite messaging capability. Today, the company has confirmed that it has partnered with MediaTek for the phone. Continue reading “Bullitt partners with MediaTek to launch world’s first smartphone with 2-way satellite messaging in Q1 2023”

MediaTek Pentonic 1000, T800 5G, Kompanio 520, and 528 chipsets announced

MediaTek announced its newest chipsets for a variety of devices today. These include the New Pentonic 1000 Chipset, the new T800 chipset solution for sub-6GHz and mmWave 5G networks, and the Kompanio 520 and Kompanio 528 chipsets for Chromebooks. Let’s take a closer look at them: Continue reading “MediaTek Pentonic 1000, T800 5G, Kompanio 520, and 528 chipsets announced”

vivo unveils V2 chip, to use it with Dimensity 9200 for AI enhancements

vivo today held the “Dual-Core X Imaging Technology Communication Conference” in China. The event, which was focused on pictures and performance, revealed new technologies, such as the in-depth collaboration between vivo and MediaTek and vivo’s new generation of self-developed chips. It also showcased Vivo’s newest achievements in independent research and development and open cooperation. Continue reading “vivo unveils V2 chip, to use it with Dimensity 9200 for AI enhancements”

MediaTek Dimensity 9200 with Cortex-X3 CPU, Immortalis-G715 GPU, UFS 4.0, Wi-Fi 7 support announced

MediaTek just announced Dimensity 9200, the company’s latest flagship SoC, as it had promised. It is the first to use second-generation TSMC’s 4nm process tech that has a better heat dissipation package design and the CPU peak performance power consumption reduced by 25%, compared to the predecessor, says the company. Continue reading “MediaTek Dimensity 9200 with Cortex-X3 CPU, Immortalis-G715 GPU, UFS 4.0, Wi-Fi 7 support announced”

MediaTek Dimensity 9200 to be announced on November 8

After rumours, MediaTek has officially confirmed the launch of its next flagship Dimensity SoC at an event in China on November 8th. The company asks How to define the next-generation new flagship benchmark? Is top performance, ultra-low power consumption? Or the ultimate gaming experience and audiovisual feast? Continue reading “MediaTek Dimensity 9200 to be announced on November 8”

Dimensity 9200 benchmark surfaces, reveals GPU improvements

Details about the the upcoming MediaTek Dimensity 9200 SoC surfaced last week. Now the AnTuTu benchmark of the chip has surfaced, revealing over 1.26 million or 12 lakh scores. The score is considerable higher than the Dimensity 9000+. It is said to use Cortex X3 prime cores compared to Cortex X2 and new Immortalis G715 GPU. Continue reading “Dimensity 9200 benchmark surfaces, reveals GPU improvements”

MediaTek Dimensity 9200 with Cortex-X3 CPU cores, G715 GPU expected in November

MediaTek introduced the Dimensity 9000 as the world’s first SoC to use TSMC’s 4nm process tech, ARM Cortex-X2 cores and Mali-G710 GPU in November last year. The Dimensity 9000+ was introduced in June, with slightly higher CPU and GPU clock speeds. Now, details about the upcoming Dimensity 9200 has surfaced. Continue reading “MediaTek Dimensity 9200 with Cortex-X3 CPU cores, G715 GPU expected in November”

MediaTek Dimensity 1080 6nm SoC with support for up to 200MP camera announced

MediaTek has introduced Dimensity 1080, the company’s latest mid-range 5G SoC with TSMC’s 6nm process technology. It has an octa-core CPU designed with Arm Cortex-A78 cores operating at up to 2.6GHz and four Arm Cortex-A55 efficiency cores clocked at 2GHz, same the the Dimensity 1100 that was introduced last year. Continue reading “MediaTek Dimensity 1080 6nm SoC with support for up to 200MP camera announced”

Invendis and MediaTek to introduce 5G and Wi-Fi routers in India

Invendis, a global provider of IoT platforms and cloud computing solutions, and MediaTek, have joined forces to release 5G and Wi-Fi router solutions. This collaboration aligns Invendis Silbo Routers with the AatmaNirbhar Campaign’s “Vocal for Local” effort. The alliance will roll out a broad spectrum of solutions and manufacturers in India. Continue reading “Invendis and MediaTek to introduce 5G and Wi-Fi routers in India”

MediaTek Pentonic 700 chipset for 4K TVs with 120Hz MEMC, Dolby Vision IQ, Wi-Fi 7 announced

The Pentonic 700 chipset for premium 120Hz 4K televisions is the latest addition to MediaTek’s Pentonic smart TV SoC series. This follows the release of Pentonic 2000, the world’s first commercial TV chip made on TSMC’s N7 (7nm-class) process for 8K televisions. Continue reading “MediaTek Pentonic 700 chipset for 4K TVs with 120Hz MEMC, Dolby Vision IQ, Wi-Fi 7 announced”

MediaTek T830 for 5G routers and mobile hotspots announced

As a new addition to its 5G portfolio (CPE), MediaTek showed off today the T830 platform, which works with 5G fixed wireless access (FWA) routers with mobile hotspot customer-premise equipment. The MediaTek M80 modem, which powers the T830 and features enhanced Release 16 technologies for sub-6GHz band operations, makes the platform perfect for 5G networks all over the world. Earlier, MediaTek Filogic 880 and 380 Wi-Fi 7 platforms were announced. Continue reading “MediaTek T830 for 5G routers and mobile hotspots announced”

Intel and MediaTek to jointly manufacture chips using Intel Foundry Services

Intel and MediaTek today announced that they will work together to make chips using the advanced process technologies of Intel Foundry Services (IFS). With the support and advice of a new foundry member with a lot of capacity in the U.S. and Europe, the agreement is meant to help MediaTek build a much more balanced and reliable supply chain. The news comes as the US semiconductor industry, and Intel in particular, are about to get a lot of money from the government to help them make more chips to sell abroad. Continue reading “Intel and MediaTek to jointly manufacture chips using Intel Foundry Services”

MediaTek Dimensity 9000+ announced: 5% faster CPU, 10% faster GPU

MediaTek today announced the Dimensity 9000+, an enhanced version of the Dimensity 9000 which was introduced in November last year. This has the same Arm’s v9 CPU architecture, 4nm octa-core process, but the 1x ultra-Cortex-X2 core operates at up to 3.2GHz compared to 3.05GHz in the Dimensity 9000 while retaining, 3 x 2.85GHz super Cortex-A710 cores and 4 x 1.8GHz efficiency Cortex-A510 cores from  the predecessor. Continue reading “MediaTek Dimensity 9000+ announced: 5% faster CPU, 10% faster GPU”