MediaTek just announced the Dimensity 9300+ as the upgraded version of the Dimensity 9300 at the MediaTek Dimensity Developer Conference (MDDC) 2024, as it had promised. Continue reading “MediaTek Dimensity 9300+ official, to power vivo X100s series and iQOO Neo9s Pro”
MediaTek has confirmed the launch of Dimensity 9300+ as the successor of the Dimensity 9300 in China at the MediaTek Dimensity Developer Conference (MDDC) 2024 on May 7th. Continue reading “MediaTek Dimensity 9300+ to be announced on May 7”
MediaTek is preparing to launch its latest 3nm chipset, the Dimensity 9400, which could incorporate ARM’s newest CPU architecture, ‘BlackHawk,’ for improved performance over chips like the A17 Pro and Qualcomm Oyron, as per tipster Digital Chat Station. Continue reading “MediaTek Dimensity 9400 with ARM ‘BlackHawk’ CPU architecture surfaces”
MediaTek has introduced Dimensity 6300 SoC in the Dimensity 6000 series after the launch of Dimensity 6100+ last year. It integrates an enhanced 5G modem supporting 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation and has MediaTek UltraSave 3.0+ technology for power saving, same as the 6100+. Continue reading “MediaTek Dimensity 6300 6nm 5G SoC announced”
MediaTek has silently introduced the Helio G91, an upgrade to Helio G88 SoC which was introduced 3 years back. This has support for up to 90Hz FHD+ display, same as the predecessor, but has support for up to 108MP main camera with in-sensor zoom, an upgrade from 64MP in the previous model. Continue reading “MediaTek Helio G91 with support for 90Hz FHD+ display, up to 108MP camera announced”
MediaTek has announced collaboration with Google to optimize Gemini Nano, Google’s innovative Large Language Model (LLM), for its flagship Dimensity 9300 and Dimensity 8300 chipsets. Continue reading “MediaTek and Google partner for on-device generative AI on Dimensity 9300 and 8300 SoCs”
Nothing today confirmed that the Nothing Phone (2a) will feature MediaTek Dimensity 7200 Pro SoC, which has been co-engineered with MediaTek to deliver the best performance with optimal power consumption. Continue reading “Nothing Phone (2a): Dimensity 7200 Pro, up to 12GB of RAM”
MediaTek is set to unveil its new Dimensity 9400 chipset in the fourth quarter of this year, according to a report from Chinese media. Continue reading “MediaTek Dimensity 9400 3nm SoC specs surface”
MediaTek just announced Dimensity 8300, the company’s latest 8000 series SoC for premium 5G smartphones, as the successor to Dimensity 8200. It uses second-generation TSMC’s 4nm process tech. Continue reading “MediaTek Dimensity 8300 4nm SoC official; Dimensity 8300-Ultra to power Redmi K70E”
MediaTek recently confirmed that it will introduce Dimensity 8300, successor to last year’s Dimensity 8200 on November 21st in China. Now the specifications of the phone has surfaced in the Geekbench 6 benchmark of the upcoming Redmi K70 phone with the model number Xiaomi 2311DRK48C. Continue reading “MediaTek Dimensity 8300 specs surface in Redmi K70 benchmark ahead of Nov 21 launch”
MediaTek just announced Dimensity 9300, the company’s latest flagship SoC, as the successor to Dimensity 9200 / 9200+. It uses third-generation TSMC’s 4nm process tech with 2nd gen thermally optimized IC design and package. Continue reading “MediaTek Dimensity 9300 official: Up to 40% faster multi-core CPU performance, 12-Core Immortalis-G720 GPU”
After Geekbench listing last week, MediaTek Dimensity 9300 SoC has surfaced in AnTuTu 10 benchmark scoring over 2 million or 20 lakh points, topping the benchmark charts for an Android phone. Continue reading “Dimensity 9300 surfaces on AnTuTu, scores over 2 million”
OPPO phone with the model number PHZ110 powered by the upcoming MediaTek Dimensity 9300 SoC has surfaced in Geekbench 6 listing. This reveals single-core score of 2139 and multi-core score of 7110. Continue reading “OPPO phone with MediaTek Dimensity 9300, 16GB RAM surfaces in benchmarks”
MediaTek and TSMC have announced that MediaTek has developed its first chip using TSMC’s 3nm technology for MediaTek’s flagship Dimensity system-on-chip (SoC). Continue reading “MediaTek develops first chip using TSMC’s 3nm process”
MediaTek has introduced Dimensity 6100+ SoC in the Dimensity 6000 series after the launch of Dimensity 6020 and 6080 SoCs. It integrates an enhanced 5G modem supporting 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation and has MediaTek UltraSave 3.0+ technology for power saving. Continue reading “MediaTek Dimensity 6100+ 6nm 5G SoC announced”
