The Pentonic 700 chipset for premium 120Hz 4K televisions is the latest addition to MediaTek’s Pentonic smart TV SoC series. This follows the release of Pentonic 2000, the world’s first commercial TV chip made on TSMC’s N7 (7nm-class) process for 8K televisions. Continue reading “MediaTek Pentonic 700 chipset for 4K TVs with 120Hz MEMC, Dolby Vision IQ, Wi-Fi 7 announced”
As a new addition to its 5G portfolio (CPE), MediaTek showed off today the T830 platform, which works with 5G fixed wireless access (FWA) routers with mobile hotspot customer-premise equipment. The MediaTek M80 modem, which powers the T830 and features enhanced Release 16 technologies for sub-6GHz band operations, makes the platform perfect for 5G networks all over the world. Earlier, MediaTek Filogic 880 and 380 Wi-Fi 7 platforms were announced. Continue reading “MediaTek T830 for 5G routers and mobile hotspots announced”
Intel and MediaTek today announced that they will work together to make chips using the advanced process technologies of Intel Foundry Services (IFS). With the support and advice of a new foundry member with a lot of capacity in the U.S. and Europe, the agreement is meant to help MediaTek build a much more balanced and reliable supply chain. The news comes as the US semiconductor industry, and Intel in particular, are about to get a lot of money from the government to help them make more chips to sell abroad. Continue reading “Intel and MediaTek to jointly manufacture chips using Intel Foundry Services”
MediaTek today announced the Dimensity 9000+, an enhanced version of the Dimensity 9000 which was introduced in November last year. This has the same Arm’s v9 CPU architecture, 4nm octa-core process, but the 1x ultra-Cortex-X2 core operates at up to 3.2GHz compared to 3.05GHz in the Dimensity 9000 while retaining, 3 x 2.85GHz super Cortex-A710 cores and 4 x 1.8GHz efficiency Cortex-A510 cores from the predecessor. Continue reading “MediaTek Dimensity 9000+ announced: 5% faster CPU, 10% faster GPU”
MediaTek unveiled the Filogic 880 and Filogic 380 Wi-Fi 7 platform solutions for high-bandwidth operator, retail, and enterprise applications, including consumer electronics. These chips will be among the first Wi-Fi 7 solutions on the market, offering device makers the ability to leverage cutting-edge devices with the latest networking technologies. The company also introduced Dimensity 1050, Dimensity 930 and Helio G99 SoCs today. Continue reading “MediaTek Filogic 880 and 380 Wi-Fi 7 platforms announced”
MediaTek today announced Dimensity 1050, its first mmWave 5G chipset for next generation of 5G smartphones. It combines mmWave 5G and sub-6GHz to fluidly migrate between network bands, and is built TSMC 6nm production process. The company said that it will be capable of delivering up to 53% faster speeds and greater reach to smartphones compared to LTE + mmWave aggregation alone. Continue reading “MediaTek Dimensity 1050 mmWave 5G, Dimensity 930 5G and Helio G99 4G 6nm SoCs announced”
MediaTek today introduced the Dimensity 8100 and Dimensity 8000 SoCs with TSMC N5 (5nm-class) production process for premium 5G smartphones. This brings Dimensity 9000’s groundbreaking technology world-firsts including Imagiq 780 photo and video capture engine, 5th generation AI processor, HyperEngine 5.0 gaming enhancements, and Release-16 5G modem. Continue reading “MediaTek Dimensity 8100 and Dimensity 8000 5nm SoCs and Dimensity 1300 6nm SoC with HyperEngine 5.0 gaming tech announced”
According to a new report from Counterpoint Research, the global smartphone AP (Application Processor)/SoC (System on Chip) witnessed a growth of 5% YoY during 2021. 5G-capable SoCs accounted for half of total shipments, and the market was led by MediaTek, Qualcomm and Apple.
Details about the Mediatek Dimensity 8000 surfaced last year, and the company teased the chip at the Dimensity 9000 launch in China in December, saying that it will be introduced soon. Today, leaker Digital Chat Station says that the company will launch the Dimensity 8100 on March 1st. This is said to be an overclocked version of the 8000. Continue reading “Mediatek Dimensity 8100 said to launch on March 1”
Acer at the CES earlier this month introduced its new Chromebook Spin 513 powered by an Octa-Core MediaTek Kompanio 1380 processor. Now, MediaTek has officially announced the company’s flagship Kompanio SoC which uses TSMC’s 6nm process tech. This has four high-performance Cortex-A78 cores clocked up to 3GHz and four Cortex-A55 power-efficiency-focused cores. There is a five-core Arm Mali-G57 GPU. Continue reading “MediaTek Kompanio 1380 6nm SoC for ultra-light premium Chromebooks, tablets announced”
Global smartphone AP (Application Processor)/SoC (System on Chip) shipments grew 6% YoY in Q3 2021, according to the latest Counterpoint report. It also said that 5G smartphone SoC shipments grew almost two times compared to the same period last year. Continue reading “Global smartphone SoC shipments up 6% YoY in Q3 2021; MediaTek leads with 40% share”
MediaTek recently introduced its flagship Dimensity 9000 SoC last month, and today at an event in China, it has confirmed that smartphone brands, including OPPO, vivo, Xiaomi and HONOR will release their flagship smartphones powered by the chip in the first quarter of next year. Continue reading “MediaTek Dimensity 9000 4nm SoC to power Redmi K50 series, OPPO Find X series, HONOR and vivo phones in Q1 2022”
MediaTek introduced its flagship Dimensity 9000 4nm SoC earlier this month. Now the specifications of the Dimensity 7000 5nm SoC has surfaced in China, thanks to leaker Digital Chat Station. This reveals that it will use 4x Cortex A78 CPUs clocked at 2.75GHz and 4 x Cortex A55 CPUs clocked at 2.0GHz. Continue reading “MediaTek Dimensity 7000 5nm SoC specs surface”
After announcing its flagship Dimensity 9000 SoC, MediaTek has unveiled its flagship TV chipset – Pentonic 2000. It is the world’s first commercial TV chip manufactured using TSMC’s N7 (7nm-class) process. Continue reading “MediaTek Pentonic 2000 world’s first 7nm chipset for 8K TVs with 120Hz MEMC, UFS 3.1, Wi-Fi 6E announced”
AMD has partnered with MediaTek to unveil their newest Wi-Fi solution, called the AMD RZ600 Series Wi-Fi 6E modules. It features the MediaTek Filogic 330P chipset inside and is designed to power the next-generation AMD Ryzen-series laptop and desktop PCs starting 2022 onwards.
Continue reading “MediaTek and AMD unveil AMD RZ600 Series Wi-Fi 6E Modules for laptops and PCs”
