MediaTek just announced Dimensity 8300, the company’s latest 8000 series SoC for premium 5G smartphones, as the successor to Dimensity 8200. It uses second-generation TSMC’s 4nm process tech. Continue reading “MediaTek Dimensity 8300 4nm SoC official; Dimensity 8300-Ultra to power Redmi K70E”
MediaTek recently confirmed that it will introduce Dimensity 8300, successor to last year’s Dimensity 8200 on November 21st in China. Now the specifications of the phone has surfaced in the Geekbench 6 benchmark of the upcoming Redmi K70 phone with the model number Xiaomi 2311DRK48C. Continue reading “MediaTek Dimensity 8300 specs surface in Redmi K70 benchmark ahead of Nov 21 launch”
MediaTek just announced Dimensity 9300, the company’s latest flagship SoC, as the successor to Dimensity 9200 / 9200+. It uses third-generation TSMC’s 4nm process tech with 2nd gen thermally optimized IC design and package. Continue reading “MediaTek Dimensity 9300 official: Up to 40% faster multi-core CPU performance, 12-Core Immortalis-G720 GPU”
After Geekbench listing last week, MediaTek Dimensity 9300 SoC has surfaced in AnTuTu 10 benchmark scoring over 2 million or 20 lakh points, topping the benchmark charts for an Android phone. Continue reading “Dimensity 9300 surfaces on AnTuTu, scores over 2 million”
OPPO phone with the model number PHZ110 powered by the upcoming MediaTek Dimensity 9300 SoC has surfaced in Geekbench 6 listing. This reveals single-core score of 2139 and multi-core score of 7110. Continue reading “OPPO phone with MediaTek Dimensity 9300, 16GB RAM surfaces in benchmarks”
MediaTek and TSMC have announced that MediaTek has developed its first chip using TSMC’s 3nm technology for MediaTek’s flagship Dimensity system-on-chip (SoC). Continue reading “MediaTek develops first chip using TSMC’s 3nm process”
MediaTek has introduced Dimensity 6100+ SoC in the Dimensity 6000 series after the launch of Dimensity 6020 and 6080 SoCs. It integrates an enhanced 5G modem supporting 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation and has MediaTek UltraSave 3.0+ technology for power saving. Continue reading “MediaTek Dimensity 6100+ 6nm 5G SoC announced”
MediaTek and NVIDIA have joined forces to develop a comprehensive lineup of in-vehicle AI cabin solutions for future software-defined vehicles. This collaboration leverages the expertise of both companies to deliver top-notch solutions for advanced connected cars. Continue reading “MediaTek and NVIDIA Pioneer AI-Accelerated Computing in Automotive”
MediaTek just announced the Dimensity 9200+, the company’s flagship SoC, an upgrade to the Dimensity 9200 that was introduced back in November. This uses the same second-generation TSMC’s 4nm process tech for power efficiency. Continue reading “MediaTek Dimensity 9200+ with up to 11% faster CPU, 17% faster GPU announced”
MediaTek has introduced yet another 7000 series chipset called the Dimensity 7050 which has similar specifications as the Dimensity 1080. This features 6nm-class technology, which enables enhanced power efficiency when combined with MediaTek 5G UltraSave to provide long-lasting performance. Continue reading “MediaTek Dimensity 7050 announced; will power Lava Agni 2 5G”
After rumours, MediaTek has officially announced that the Dimensity 9200+, the company’s flagship SoC will be announced on May 10th, after the Dimensity 9200 was introduced back in November. Continue reading “MediaTek Dimensity 9200+ to be announced on May 10, could power iQOO Neo8 Pro, Redmi and ROG phones”
MediaTek already confirmed that it will launch Bullitt phone with smartphone to include a two-way satellite messaging capability. Today, the company has introduced MT6825 chipset for world’s first commercially available devices from Bullitt with 3GPP NTN technology. Continue reading “MediaTek MT6825 IoT-NTN chipset for smartphones with 2-way satellite messaging unveiled”
At MWC 2023, MediaTek will be showcasing its Dimensity, Filogic, Genio, Kompanio, and Pentonic portfolios, along with new 5G demos. They will also demonstrate their satellite communications platform and display devices from some of the world’s biggest brands. Continue reading “MediaTek to showcase next-gen technologies at MWC 2023”
MediaTek has introduced the Dimensity 7200, the company’s first SoC in the new 7000 series. This uses 4nm-class process, same as the 8200, offering improved power efficiency compared to 5nm. Continue reading “MediaTek Dimensity 7200 4nm Octa-Core SoC announced”
MediaTek just introduced the Helio G36, the company’s latest SoC in the Helio G series that will power the upcoming entry-level gaming smartphones in India. This 12nm chip has a 2.2GHz octa-core Arm Cortex-A53 CPU and an IMG PowerVR GE8320 GPU. To remind you, the company introduced the Helip G37 chip with the moto g22 last year. Continue reading “MediaTek Helio G36 to power budget gaming phones in India”
