MediaTek recently confirmed that it will introduce Dimensity 8300, successor to last year’s Dimensity 8200 on November 21st in China. Now the specifications of the phone has surfaced in the Geekbench 6 benchmark of the upcoming Redmi K70 phone with the model number Xiaomi 2311DRK48C.
The MediaTek Dimensity 8300 said to use 1 × 3.35GHz Cortex-A715 performance core + 3 × 3.32GHz Cortex-A715 performance core + 4 × 2.2GHz Cortex-A510 power efficient cores and Mali-G615 MC6 GPU.
The Dimensity 8300 has a single-core score of 1512 and a multi-core score of 4886, making it slightly better than the Dimensity 8200 and the 8200-Ultra. According to leaker Digital Chat Station, the performance will be better than Qualcomm Snapdragon 7+ Gen 2 SoC. The chip will use TSMC’s N4 process.
The Redmi K70 will come with up to 16GB of RAM and run Android 14, reveals the Geekbench leak. There will also be another Redmi K70 model powered by Snapdragon 8 Gen 3, the company already revealed.