MediaTek just announced the Dimensity 9200+, the company’s flagship SoC, an upgrade to the Dimensity 9200 that was introduced back in November. This uses the same second-generation TSMC’s 4nm process tech for power efficiency.
It offers higher clock speeds than the Dimensity 9200, since this has 1 x ultra-core Arm Cortex-X3 clocked at up to 3.35GHz compared to 3.05GHz, 3 x Arm Cortex-A715 super-cores running up to 3.0GHz compared to 2.85GHz, and 4 x Arm Cortex-A510 efficiency cores at 2.0GHz compared to 1.8GHz. The performance cores are 10% faster and the efficiency cores are 11% faster compared to Dimensity 9200.
The Arm Immortalis-G715 GPU clocked at 1150MHz compared to 981MHz sees a 17% performance boost compared to the Dimensity 9200.
Other features are similar, including a 4CC-CA 5G Release-16 modem that switches between long-reach sub-6GHz and superfast mmWave connections. There is Wi-Fi 7 2×2 + 2×2 with up to 6.5Gbps data rate, along with Bluetooth 5.3.
It has Sixth generation AI Processing Unit (APU 690), MediaTek Imagiq 890 image signal processor, MediaTek MiraVision 890 and MediaTek 5G UltraSave 3.0.
Smartphones powered by the MediaTek Dimensity 9200+ are expected to be released in May 2023. iQOO has confirmed that its iQOO Neo series phone will be the first phone to be powered by the chip. It is said to be Neo8 Pro, and the launch date of the phone will be announced by the company tomorrow.