MediaTek Dimensity 9400 3nm SoC specs surface

MediaTek is set to unveil its new Dimensity 9400 chipset in the fourth quarter of this year, according to a report from Chinese media.

On January 30th, MediaTek celebrated the Zhubei office building, dubbed Taiwan’s new tech landmark. Chairman Tsai Ming-chie anticipates its completion in 2027, marking a significant milestone for MediaTek.

CEO Cai Lixing highlighted the success of the Dimensity 9300 chip and expressed confidence in the rising trend of AI mobile phone. The upcoming Dimensity 9400, slated for launch this year, will utilize TSMC’s 3nm process, surpassing the 9300 with advanced AI features.

MediaTek Dimensity 9400 SoC

This upcoming SoC will be the first in the Dimensity series manufactured using TSMC’s 3nm process node, specifically the N3E, promising improved performance and energy efficiency.

The Dimensity 9400 is expected to feature a configuration with one Cortex-X5 Prime CPU core, four Cortex-X4 Prime CPU cores, and four Cortex-A720 performance CPU cores.

While MediaTek did not explicitly name the chip as the Dimensity 9400, it aligns with the details shared by Chairman Tsai. The new chipset will support LPDDR5T RAM, crucial for on-device AI capabilities, potentially surpassing the 33 billion parameter large language model of the Dimensity 9300.

A potential competitor to this could be Qualcomm’s Snapdragon 8 Gen 4, also utilizing TSMC’s second-gen 3nm node. The estimated performance specifications indicate that the Dimensity 9400 may process 12 to 15 tokens per second using the 7-billion parameter Llama 2 model. Additionally, it is expected to offer improved image creation speed compared to the Dimensity 9300.

MediaTek’s collaboration with TSMC on 3nm chip development is progressing, with mass production scheduled later this year. The official announcement revealing more about the Dimensity 9400’s performance is expected in Q4 2024.