Soon after Computex and Investor Day, Qualcomm has confirmed that the company’s ninth annual Snapdragon Summit for this year will happen from September 22nd to 24th, 2026, in Maui, Hawaii. Continue reading “Snapdragon Summit 2026 set for September 22 to 24”
At its annual Investor Day, Qualcomm Technologies, Inc. announced a major expansion into full-stack data center infrastructure, debuting a roadmap of AI-focused processors, custom silicon solutions, and high-speed connectivity products. Continue reading “Qualcomm introduces Dragonfly C1000 data center CPU, Dragonfly AI300 Accelerator and more”
At the Augmented World Expo (AWE) 2026, Qualcomm Technologies, Inc. announced the launch of the Snapdragon® Scalable Turnkey AI-Ready Toolkit (START) program. The initiative is structured to assist brands in accelerating the development and commercialization of personal AI devices, with an initial focus on the smart glasses category. Continue reading “Qualcomm Snapdragon START Program to accelerate personal AI devices introduced”
At the Augmented World Expo (AWE) 2026, Qualcomm Technologies, Inc. announced the launch of its Snapdragon® Reality Elite Platform. Designed to power immersive spatial computing, the new platform targets a spectrum of form factors, including high-performance all-in-one video-see-through (VST) headsets and lightweight tethered optical-see-through (OST) glasses. Continue reading “Qualcomm Snapdragon Reality Elite Platform for Spatial Computing and Generative XR announced”
At Computex 2026, ASUS unveiled the ASUS Ascent QN10, marking the expansion of its artificial intelligence mini-PC lineup. Developed in collaboration with Qualcomm Technologies, the device represents the first mini-PC to integrate the Snapdragon® X2 Elite platform, shifting the Snapdragon X series processors beyond laptops and into small form factor desktop computing. Continue reading “ASUS Ascent QN10 powered by Snapdragon X2 Elite announced”
Qualcomm has introduced Dragonwing IQ10 Robotics Reference Design (RRD) that is built to address production-level requirements, offering a unified foundation for sensor-AI systems that demand flexible execution, modular expansion, and predictable deployment. Continue reading “Qualcomm debuts Dragonwing IQ10 Robotics Reference Design for Industrial and Humanoid AI”
Qualcomm Technologies, Inc. has announced the Snapdragon® C Platform, a new entry-tier processor developed to provide modern personal computing features to mainstream consumers, including students, families, and small businesses. Continue reading “Qualcomm Snapdragon C Platform to power entry-level laptops from Acer, HP, Lenovo and more later this year”
Qualcomm has expanded its hardware portfolio with the introduction of the Dragonwing MBM (Mobile Broadband Multimedia) Family. Positioned alongside existing Dragonwing MBB (Mobile Broadband) and FWA (Fixed Wireless Access) products, this new product line introduces dedicated on-device AI, high-end imaging pipelines, and robust UI rendering capabilities directly into the broadband tier. Continue reading “Qualcomm introduces Dragonwing MBM Family for interactive multimedia broadband”
Nirvana by boAt has announced the integration of Snapdragon Sound into its upcoming audio portfolio. With Snapdragon Sound™ at its core, the company aims to bring next-generation audio capabilities to its premium truly wireless audio segment. Continue reading “boAt Nirvana Eutopia 2 Pro with Snapdragon Sound teased ahead of launch”
Qualcomm has officially announced the Snapdragon 6 Gen 5 and Snapdragon 4 Gen 5 Mobile Platforms at the Qualcomm Snapdragon for India event, expanding its portfolio with next-generation capabilities. Continue reading “Qualcomm Snapdragon 6 Gen 5 and 4 Gen 5 Platforms announced”
Qualcomm Technologies, Inc. and Specs Inc., a subsidiary of Snap, have established a multi-year strategic agreement. Under this partnership, future generations of Specs eyewear will be powered by Qualcomm’s Snapdragon system-on-a-chip (SoC) technology. Continue reading “Snap Specs Snapdragon XR-powered smart eyewear coming later this year”
Qualcomm’s Arduino has announced the upcoming launch of Arduino VENTUNO Q, a platform designed for edge AI, robotics, and actuation. The board is powered by the Dragonwing IQ8 Series, providing high-performance AI processing and deterministic real-time control for offline autonomous systems. Continue reading “Arduino VENTUNO Q with Qualcomm Dragonwing IQ8 for edge AI and autonomous robotics announced”
Qualcomm Technologies, Inc. has introduced its next-generation AI-ready Wi-Fi 8 portfolio, featuring the FastConnect 8800 Mobile Connectivity System and five Dragonwing Networking Platforms. The portfolio provides high-speed, extended-range, and intelligent connectivity for mobile devices, routers, broadband gateways, and enterprise access points, supporting applications across smartphones, laptops, tablets, and robotics. Continue reading “Qualcomm FastConnect 8800 with Wi-Fi 8, Proximity AI, and Bluetooth 7 announced”
Qualcomm Technologies has introduced the Qualcomm X105 5G Modem-RF, the industry’s first 3GPP Release 19-ready modem designed for high-performance 5G Advanced and as a foundation for future 6G deployment. Continue reading “Qualcomm X105 5G Modem-RF R19-ready with quad-band GNSS and AI processor announced”
At the MWC 2026, Qualcomm introduced the Snapdragon Wear Elite Platform, a new computing platform aimed at integrating artificial intelligence (AI) directly into wearable devices. Designed to operate across WearOS by Google, Android, and Linux, the platform incorporates a Neural Processing Unit (NPU) and a suite of low-power connectivity options to support on-device AI operations. Continue reading “Qualcomm Snapdragon Wear Elite Platform for AI-Driven Wearables announced”
