Bluetooth 5 with improved range and speed to be announced on June 16

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Bluetooth Special Interest Group (Bluetooth SIG) has announced that the next version of Bluetooth will be called as Bluetooth 5. Mark Powell, the SIG’s Executive Director has revealed that the latest version will be officially announced on June 16. Continue reading “Bluetooth 5 with improved range and speed to be announced on June 16”

List of Windows Phone 8 Bluetooth profiles revealed

The Bluetooth SIG has finally posted the Bluetooth profile list supported by Windows Phone 8 and it looks like the number of profiles supported has improved quite a bit compared to Windows Phone 7. Addition of the OBEX (Object Exchange) profile means that the phone should theoretically be able to both send and receive objects though specifics around that remain to be revealed.

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Bluetooth Ultra Wide Band chips to appear in 2007

Bluetooth SIG (Bluetooth Special Interest Group) has said that the future high-speed version of Bluetooth standard will involve UWB (Ultra-Wideband) technology. They chose the version promoted by WiMedia Alliance ? MB-OFDM (multiband orthogonal frequency division multiplexing).

It will enable larger data transfer at higher speeds, including high quality multimedia content. At the same time the technology can be applied by low power devices, as for example, wireless keyboards and mices.

According to Bluetooth SIG, MB-OFDM technology complies with the requirements of low price, low power consumption, security functions and can be applied in mobile devices. The first Bluetooth/UWB chips are expected to be ready for use in protos in 2Q 2007.

Bluetooth SIG for Bluetooth adoption in India

Early adoption of Bluetooth wireless technology in India will begin with the mobile phone and headset application

The Bluetooth Special Interest Group (SIG) is a trade association comprised leaders in the telecommunications, computing, automotive, industrial automation and network industries that is driving the development of Bluetooth wireless technology and bringing them to market.

Read this article at CIOL