Samsung Electronics is reportedly developing a new advanced packaging technology for its upcoming mobile application processor (AP), the Exynos 2600, according to ZDNET Korea. This innovation aims to integrate heat-dissipating materials directly within the semiconductor package, potentially enhancing the performance of next year’s Galaxy S26 smartphone series. Continue reading “Samsung Exynos 2600 2nm SoC could get Heat Pass Block”
Most Chinese players have started using silicon-carbon battery technology widely from last year, offering them to pack large batteries without compromising the size of the phone or the weight. Samsung will finally adopt silicon-carbon batteries for its Galaxy S26 series, reports Fnnews from Korea. Continue reading “Samsung Galaxy S26 series could get a bigger silicon-carbon battery”
Samsung is gearing up to mass-produce flagship smartphone application processors (APs) using the 2nm node by the second half of next year. This new process, dubbed SF2, will debut with the Exynos 2600 AP. Continue reading “Samsung said to be gearing up for 2nm Chip development for Galaxy S26 series”
