MediaTek Dimensity 1000 Octa-Core 7nm SoC with built-in 5G announced

MediaTek just announced Dimensity 1000, the company’s latest flagship SoC with built-in 5G, as it had promised. It is the company’s first chip to use 7nm process technology, and uses four Cortex-A77 cores operating up to 2.6GHz and four power-efficient ARM Cortex-A55 cores operating at up to 2.0GHz. It also packs ARM Mali-G77 GPU.

The SoC supports 5G two carrier aggregation (2CC CA) with 4.7Gbps downlink and 2.5Gbps uplink speeds over sub-6GHz networks. The chipset is designed to support stand alone and non-stand alone (SA/NSA) sub-6GHz networks, and includes multi-mode support for every cellular connectivity generation from 2G to 5G. It also integrates the latest Wi-Fi 6 and Bluetooth 5.1+ standards.

It comes with MediaTek AI Processing Unit — APU 3.0 — with more than double the performance of the previous generation APU, and brings devices a significant performance boost at 4.5 TOPS.

Features and technology in the MediaTek Dimensity 1000:

  • Dual 5G SIM technology, in addition to support for services such as Voice over New Radio (VoNR), the 5G SoC delivers seamless connectivity across networks and offers consistent speeds.
  • 5G carrier aggregation. Performs a seamless handover between two connection areas (high speed layer and coverage layer) for seamless high speed connections when users are on the go.
  • Five-core image signal processor (ISP) combined with MediaTek’s Imagiq+ technology for support for 80MP cameras sensors at 24 frames per second and a range of multi-camera options such as 32+16MP dual cameras.
  • Advanced AI-camera enhancements for autofocus, auto exposure, auto white balance, noise reduction, high-dynamic-range (HDR) and facial detection, along with multi-frame video HDR capability.
  • Support for Full HD+ displays up to 120Hz and 2K+ up to 90Hz. First mobile SoC to support Google AV1 format up to 4K resolution at 60fps

The Dimensity 1000 is already shipping to OEMs and the first Dimensity powered devices will start hitting the market in Q1 of 2020, said the company.

MediaTek Dimensity 1000 vs  Helio G90T specifications

  Dimensity 1000  Helio G90T
Process 7nm 12nm
CPU 4x Cortex-A77 @ 2.6GHz
4x Cortex-A55 @ 2GHz
2x Cortex-A76 @ 2.05 GHz
6x Cortex-A55 @ 2GHz
Memory 2X LPDDR4x Up to 2133MHz up to 10GB, UFS 2.1 2X LPDDR4x Up to 2133MHz up to 10GB, eMMC 5.1 / UFS 2.1
Camera 32MP+16MP, 80MP, Multi-camera

HDR-ISP (3+2) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD

24MP+16MP, 64MP, Quad camera

3X ISP; AI Face Detection; HW depth engine; AINR; Single-Cam/Dual-Cam Bokeh; Hardware Warping Engine (EIS); Rolling Shutter Compensation (RSC) engine; MEMA 3DNR; Multi-Frame Noise reduction;

Display 2520 x 1080 (Full HD+) at 21:9 120Hz 2520 x 1080 (Full HD+) at 21:9 90Hz
Video Decode / Video Encode 2160p (2160 x 1080), h.264, h.265 / HEVC 4K 30fps, FHD 120fps, HD 240fps 2160p (2160 x 1080), h.264, h.265 / HEVC 4K 30fps, FHD 120fps, HD 240fps
Graphics Mali-G77 MC9 ARM Mali G76 3EEMC4 @ 800MHz
Modem 5G SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, 2×2 MIMO, 256QAM VoNR / EPS fallback Cat-12 DL / Cat-13 UL, 4X4 MIMO, 3XCA, 256QAM, TAS 2.0, HPUE, IMS (VoLTE\ViLTE\WoWi-Fi), eMBMS, Dual 4G VoLTE (DSDS), Band 71
Connectivity Integrated Dual-Band Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.1,
GPS + Glonass + Beidou + Galileo, FM radio
Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.0,
GPS + Glonass + Beidou + Galileo, FM radio


Author: Srivatsan Sridhar

Srivatsan Sridhar is a Mobile Technology Enthusiast who is passionate about Mobile phones and Mobile apps. He uses the phones he reviews as his main phone. You can follow him on Twitter and Instagram