MediaTek has silently announced Dimensity 7100, its latest 5G chipset for next generation of mid-range 5G smartphones. It is built TSMC 6nm production process. The company said that it will be up to 5% more power‑efficient in apps, up to 23% more power‑efficient modem, up to 16% more power‑efficient multimedia playback compared to the predecessor.
It added that the chip features a GPU upgrade powers games up to 8% faster, compared to the predecessor for smoother, and longer gameplay. There is a new power-management system with integrated 45W fast charging, support for UFCS universal power adapters, and extra-low voltage operation that extends battery life by up to 7% compared with standard voltage designs.
MediaTek Dimensity 7100 specifications
- Octa Core: 4 x Arm Cortex-A78 @ 2.4GHz, 4 x Arm Cortex-A55 @ 2.0GHz
- GPU: Arm Mali-G610 MC2
- Process: 6nm TSMC
- Memory support: LPDDR5 @ 5500 Mbps, LPDDR4x @ 4266 Mbps
- Storage support: UFS 3.1
- Max Display Resolution: Up to 1200 x 2600
- Cellular Technologies: 2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
- Cellular Functions: 3GPP R16, Global SA & NSA; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 140 MHz bandwidth, 256QAM NR UL 1CC, 256QAM VoNR, Dual VoNR, Dual 5G SIM, EPS fallback
- Camera: Max 200MP Camera support, advanced HDR video using DCG/DAG technology
- 1T1R Wi-Fi Antenna, Up to Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.4, Bluetooth Long Range, BT/Wi-Fi Hyper Coexistence
Availability
MediaTek has not confirmed the details about the availability of the Dimensity 7100 chip. Based on rumours, the Infinix Note Edge launching this January could be the first phone to use the chip.