Qualcomm Snapdragon X2 Plus 3nm SoC with 80 TOPS NPU announced


At CES, Qualcomm announced the Snapdragon X2 Plus platform, the newest addition to the Snapdragon X Series as the successor to Snapdragon X Plus. Designed to power Windows 11 Copilot+ PCs, the platform is positioned to serve modern professionals and creators requiring high performance and portability.

Architecture and Performance

The Snapdragon X2 Plus is built on a 64-bit architecture and features the third-generation Qualcomm Oryon CPU. The platform is available in two distinct configurations: a 10-core variant (part number X2P-64-100) and a 6-core variant (part number X2P-42-100).

Both versions support a multi-core maximum frequency of 4.0 GHz, promising 35% faster  single-core CPU performance, while using 43% less power compared to the previous generation.

Graphics processing is handled by the Qualcomm Adreno GPU, designed to deliver immersive visuals. The GPU performance differs between the two variants; the 10-core model operates at a frequency of 1.7 GHz, while the 6-core model operates at 0.9 GHz. The platform supports LPDDR5X memory with a transfer rate of 9523 MT/s and a maximum capacity of 128 GB.

AI Capabilities

A central feature of the Snapdragon X2 Plus is its focus on artificial intelligence. It integrates the Qualcomm Hexagon NPU, which delivers 80 TOPS (Trillions of Operations Per Second) of AI performance. This NPU is engineered to handle next-generation agentic AI experiences and effortless multitasking. Qualcomm states that the platform supports over 50 on-device AI experiences, accelerating workflows such as photo and video editing and multimodal content generation.

Connectivity and Battery Life

The platform includes the Snapdragon X75 5G Modem-RF System and the Qualcomm FastConnect 7800 System, providing support for 5G, Wi-Fi 7, and Bluetooth 5.4. Connectivity features allow for high-speed access and High Band Simultaneous operations.

Regarding energy efficiency, the Snapdragon X2 Plus is designed to offer multi-day battery life. Intelligent power management distributes power to maintain consistent responsiveness, ensuring there is no drop in performance when the device is running on battery power.

Security Features

Security is managed through a combination of hardware and cloud technologies. The platform utilizes the Qualcomm SPU with Microsoft Pluton to provide chip-to-cloud protection. Additionally, optional Snapdragon Guardian Technology offers enterprise-grade protection, including automatic presence detection and biometric authentication. This system also supports Out-of-Band (OOB) remote manageability for maintenance and security updates.

Feature Snapdragon X2 Plus Snapdragon X Plus
Process Technology 3nm 4nm
NPU Performance 80 TOPS 45 TOPS
Memory Speed LPDDR5X (9523 MT/s) LPDDR5X (8448 MT/s)
CPU Architecture 3rd Gen Qualcomm Oryon™ Qualcomm Oryon™
Top Tier Model

10-Core (X2P-64-100)

Max Frequency: 4.0 GHz

10-Core (X1P-64-100)

Max Frequency: 3.4 GHz

Entry Tier Model

6-Core (X2P-42-100)

Max Frequency: 4.0 GHz

8-Core (X1P-42-100)

Max Frequency: 3.4 GHz

GPU Architecture Qualcomm Adreno (X2-45) Qualcomm Adreno
5G Modem Snapdragon X75 5G Modem-RF System Snapdragon X65 5G Modem-RF System
Wi-Fi Connectivity Wi-Fi 7 (FastConnect 7800) Wi-Fi 7 (FastConnect 7800)
Availability

Devices featuring the new Snapdragon X2 Plus chipset are expected from leading OEMs in the first half of 2026.


Author: Srivatsan Sridhar

Srivatsan Sridhar is a Mobile Technology Enthusiast who is passionate about Mobile phones and Mobile apps. He uses the phones he reviews as his main phone. You can follow him on Twitter and Instagram