TP-Link has introduced Neffos X1 and X1 Max smartphones at the ongoing IFA this week. Both these have unibody metal design with 2.75mm narrow edges and 0.6-millimeter ultra-slim chamfer, are powered by MediaTek Helio P10 SoCs, run Android 6.0 (Marshmallow) and have a fingerprint sensor on the back to unlock the phone in 0.2 seconds. Continue reading “TP-Link Neffos X1 and X1 Max with metal body, Helio P10, fingerprint sensor announced”