Fujifilm has announced plans to establish a greenfield semiconductor materials manufacturing facility in India, representing a total investment of approximately ₹800 crore (~US$83 million). The initiative aligns with the Government of India’s India Semiconductor Mission (ISM) 2.0 and is designed to strengthen local supply chain capabilities for advanced chip manufacturing.
The development will follow a two-phase, staggered investment model tailored to customer demand and the broader expansion of the domestic chip sector:
- Phase 1: Scheduled to break ground in financial year 2026, focusing on the production of front-end process chemicals. Commercial operations are targeted for fiscal year 2028.
- Phase 2: Planned to expand manufacturing into semiconductor surface conditioning materials and high-purity process chemicals, scaling in tandem with market growth.
The investment arrives amid broader momentum in India’s semiconductor landscape. Speaking at SEMICON India 2025, Prime Minister Narendra Modi characterized chips as “digital diamonds,” emphasizing India’s objective to secure a significant presence in the global $1 trillion semiconductor market.
As of September 2026, the sector has transitioned from initial policy frameworks to operational implementation, with 12 approved semiconductor and display manufacturing units underway—accounting for roughly $20 billion in total commitments—and three facilities currently manufacturing commercial chips.
Fujifilm intends to leverage incentives under the ISM 2.0 policy, which received formal government approval in July 2026. By introducing specialized front-end chemical manufacturing to the region, the company aims to support both legacy and leading-edge nodes, integrating its Indian operations into a broader global manufacturing network that spans Japan, the United States, Europe, and East Asia.