Qualcomm Technologies has announced the Dragonwing Q-2390 and IQ-2390 processors ahead of IFA 2026. The Dragonwing Q-2390 is designed for consumer, commercial and enterprise IoT products, while the Dragonwing IQ-2390 is the first processor in the company’s new IQ2 Series for industrial edge applications.
Qualcomm Dragonwing Q-2390
The Dragonwing Q-2390 is designed for commercial, enterprise and consumer products that require edge computing within cost, power and size constraints. It integrates the following capabilities into a single platform:
- Application compute
- On-device AI
- Camera and display support
- LTE Cat 4
- GPS location capabilities
- Wired and wireless connectivity options
- Security
- Extensive I/O capabilities
The Q-2390 is designed for applications including:
- Retail point-of-sale systems
- Kiosks
- Access control devices
- Smart appliances
- Smart agriculture
- Home robots
- Fitness equipment
- Enterprise terminals
The integrated platform is intended to reduce system complexity and development costs for device makers.
Qualcomm Dragonwing IQ-2390
The Dragonwing IQ-2390 is the first processor in the new IQ2 Series, a family of industrial edge AI processors designed for a broader range of industrial and compute applications. The IQ2 Series complements Qualcomm’s Dragonwing IQ10, IQX, IQ9, IQ8 and IQ6 Series portfolios.
The IQ-2390 is designed for compact edge systems requiring reliable operation, real-time responsiveness and long product lifecycles. It is intended for applications across:
- Industrial automation
- Oil and gas
- Utilities
- Energy
The processor combines application processing, machine vision and AI acceleration with dual Gigabit Ethernet and Time-Sensitive Networking (TSN). It is designed for systems such as:
- Human-machine interfaces (HMIs)
- Programmable logic controllers (PLCs)
- Gateways
- Industrial vision systems
- Building automation platforms
- Energy management solutions
The IQ-2390 supports operation across an extended temperature range of -30°C to +115°C and includes features intended for environments subject to vibration and shock. It is designed for industrial deployments in factories, energy infrastructure and outdoor industrial environments.
Its architecture is intended to simplify the deployment of AI-enabled industrial systems while reducing bill of materials, board space and integration complexity. The processor is provided in a ruggedized package for demanding industrial applications.
Hardware and software
Both processors feature the same core hardware and operating system support:
- Quad-core Qualcomm Kryo CPU
- Qualcomm Adreno 704 GPU
- Real-time RISC-V MCU
- Linux support
- Android support
- Zephyr OS support
The platforms are designed to reduce design complexity and system cost while enabling OEMs and developers to build connected devices across different IoT segments.
Quick Specifications: Dragonwing Q-2390 / Dragonwing IQ-2390
| Feature | Dragonwing Q-2390 | Dragonwing IQ-2390 |
|---|---|---|
| CPU | 1× Cortex-A78 + 3× Cortex-A55, up to 1.9GHz | 1× Cortex-A78 + 3× Cortex-A55, up to 1.9GHz |
| NPU | Qualcomm Hexagon, 1.1 TOPS | Qualcomm Hexagon, 1.1 TOPS |
| GPU | Adreno 704, 1.1GHz | Adreno 704, 1.1GHz |
| Memory | LPDDR4x, 1.8GHz, 16-bit, 2-channel | LPDDR4x, 1.8GHz, 16-bit, 2-channel |
| DSP | Hexagon V661, 1.1GHz | Hexagon V661, 1.1GHz |
| Display | FHD at 60Hz | FHD at 60Hz |
| Video | 1080p at 30fps | 1080p at 30fps |
| Camera | 2 cameras; up to 25MP single / 13MP dual | 2 cameras; up to 25MP single / 13MP dual |
| PCIe | PCIe 2.0, 1-lane | PCIe 2.0, 1-lane |
| USB | 1× USB 3.1 + 1× USB 2.0 | 1× USB 3.1 + 1× USB 2.0 |
| Ethernet | 2× 1GbE | 2× 1GbE |
| Storage | eMMC 5.1, SD 3.0 | eMMC 5.1, SD 3.0 |
| OS | Android, Linux Yocto, Ubuntu, Zephyr | Android, Linux Yocto, Ubuntu, Zephyr |
| Cellular | LTE Cat 4 | — |
| Wi-Fi | Wi-Fi 5 | Wi-Fi 5 |
| Bluetooth | Bluetooth 5.0/5.1 | Bluetooth 5.0/5.1 |
| Package | 12 × 12 × 0.92mm, 0.4mm pitch | FCBGA, 18.4 × 21.3 × 1.82mm, 0.8mm pitch |
| Operating temperature | -30°C to 115°C | -30°C to 115°C |
| Longevity | Until 2036 | Until 2036 |
Availability
The Dragonwing Q-2390 and IQ-2390 System-on-Modules (SOMs) are being showcased on-site at IFA 2026. Customer engagement is already underway through an early access program, while evaluation kits for both platforms are expected to be available in early 2027.
Speaking on the launch, Jeff Arnold, VP & GM, Auto Telematics & Industrial & Embedded IoT Consumer and Connectivity, Qualcomm Technologies, Inc., said:
AI is creating a fundamental shift in how connected devices are designed and deployed, but many product categories still face barriers around cost, complexity and integration. With the Dragonwing Q-2390 and IQ-2390 processors, we’re enabling intelligence to scale across a much broader range of devices, from retail systems, smart appliances and consumer robots to industrial controllers, machine vision systems and critical infrastructure. Together, these platforms help bring advanced edge AI within reach of more customers and more industries than ever before.