Qualcomm introduced the Snapdragon Wear 4100 based on new ultra-low power hybrid architecture in 2020. Now the company is said to be working on the successors – Snapdragon Wear 5100 and 5100+. The Snapdragon Wear 5100 is said to use Molded Lesser Package (MLP) that will feature SoC and PMC separately, and the Molded Embedded Package (MEP) in the Snapdragon Wear 5100+ is said to combine them. Continue reading “Qualcomm Snapdragon Wear 5100 and 5100+ for wearables said to be in the works”