MediaTek has introduced Dimensity 7450, another 7000 series chipset, as the successor to last year’s Dimensity 7400. Similar to last year, there is also Dimensity 7450X designed for flip-style foldable devices with support for dual displays.
Both these octa-core SoCs pack 4X Arm Cortex-A78 cores at up to 2.6 GHz paired with 4X Arm Cortex-A55 cores, with no change compared to the predecessor. The AI performance has increased up to 7% in AI-specific tasks, particularly benefiting computational photography, says the company. This also uses an upgraded 5G R17 modem compared to the 5G R16 modem in the predecessor.
5G Connectivity and Networking
The Dimensity 7450 incorporates an upgraded 5G modem that adheres to the global 3GPP Release 17 standard. It supports both Standalone (SA) and Non-Standalone (NSA) networking modes, Sub-6GHz 5G, and mixed FDD/TDD duplexing.
- Carrier Aggregation and Speeds: Utilizing 3CC carrier aggregation with up to 140MHz of spectrum, the chip can achieve peak 5G downlink speeds of 3.27Gbps.
- Power Efficiency: The integrated MediaTek 5G UltraSave 3.0+ technology is designed to provide up to 20% better power efficiency in typical Sub-6GHz usage scenarios.
- Scenario Enhancements: It includes a second-generation high-speed rail mode that improves performance by up to 20% in transit, alongside optimized network recovery times when emerging from dead zones.
- Local Connectivity: The SoC supports tri-band Wi-Fi 6E with a 2T2R antenna setup and Bluetooth 5.4. MediaTek’s Network Observation System (NOS) further assists by predicting network conditions to smoothly switch between 5G and Wi-Fi.
MediaTek Dimensity 7450 and Dimensity 7450X specifications
| Category | Specification |
| CPU Architecture | Octa-core (8): 4x Arm Cortex-A78 (up to 2.6GHz) + 4x Arm Cortex-A55 |
| GPU | Arm Mali-G615 MC2 |
| Manufacturing Process | 4nm-class |
| Memory Support | LPDDR5 / LPDDR4x (Up to 6400Mbps) |
| Storage Support | UFS 3.1 / UFS 2.2 |
| Cellular Modem | 3GPP R17 5G Modem (SA/NSA, Sub-6GHz) |
| Peak 5G Downlink | Up to 3.27Gbps (3CC Carrier Aggregation, 140MHz bandwidth) |
| Local Connectivity | Wi-Fi 6E (a/b/g/n/ac/ax), 2T2R antenna, Bluetooth 5.4 |
| Location Services | GPS, BeiDou, Glonass, Galileo, QZSS, NavIC |
| Max Camera Sensor | 200MP (Imagiq 950 ISP, 12-bit HDR) |
| Max Video Capture | 4K @ 30fps (3840 x 2160), 4K Video HDR, Video EIS |
| Max Display Support | WFHD+ @ 120Hz or Full HD+ @ 144Hz |
| AI Processor | MediaTek 6th generation NPU |
We can expect the rollout of the MediaTek Dimensity 7450 and Dimensity 7450X chips in smartphones in the coming months.