Qualcomm QCC730 Wi-Fi solution and RB3 Gen 2 for IoT and embedded applications announced

Qualcomm Technologies has revealed its latest innovations at the Embedded World Exhibition & Conference. These additions aim to enhance the capabilities of customers in the embedded ecosystem.

At the event, over 35 companies showcased Qualcomm technologies or supported application development, showcasing the extensive reach of the company’s ecosystem.

Among the unveilings are the Qualcomm QCC730 Wi-Fi solution and Qualcomm RB3 Gen 2 Platform, offering significant upgrades for on-device AI, high-performance processing, low-power consumption, and connectivity in IoT products and applications.

Qualcomm QCC730 Wi-Fi solution

The Qualcomm QCC730 is a groundbreaking micro-power Wi-Fi system tailored for IoT connectivity. It boasts up to 88% lower power consumption compared to previous generations, potentially revolutionizing battery-powered industrial, commercial, and consumer applications.

The QCC730 comes with an open-source IDE and SDK supporting cloud connectivity offloading, enhancing development ease. Its versatility allows developers to utilize it as a high-performance alternative to Bluetooth IoT applications, enabling flexible design and direct cloud connectivity.

Other members of Qualcomm’s IoT connectivity product family include QCC711 and QCC740, catering to various connectivity needs.

Key features of the QCC730 include:
  • Unprecedented low power consumption for extended battery life
  • Flexibility to operate in hostless or hosted mode
  • Versatile system integration for ease of design
  • Complete cloud connectivity stack with open-source software SDK
Qualcomm RB3 Gen 2 Platform

The Qualcomm RB3 Gen 2 Platform, powered by the Qualcomm QCS6490 processor, offers high-performance processing, increased on-device AI capabilities, support for multiple camera sensors, computer vision, and integrated Wi-Fi 6E.

This platform targets a wide range of products including robots, drones, industrial handheld devices, cameras, AI edge boxes, and intelligent displays.

Development kits for RB3 Gen 2 include a development board, power supply, USB cable, speakers, setup guide, and tools. Vision Kit contents include mounting bracket, high-resolution and low-resolution CSI cameras.


Key features of the RB3 Gen 2 Platform include:
  • Advanced ISPs for superior image and video capture
  • AI-accelerated workplace security
  • Fast wireless connectivity with Wi-Fi 6E
  • Enhanced Bluetooth 5.2 and LE audio
  • Expandability for GPIOs, I2C, SPI, UART, PCIe, USB, MIPI CSI/DSI, and SDIO

In addition, Qualcomm Technologies will introduce an industrial-grade platform to address functional safety and environmental requirements in industrial applications.

This platform, available in June 2024, will feature high-performance CPU, GPU, on-device AI capabilities, and support for industrial I/O needs.

Speaking about the launch, Jeff Torrance, Senior Vice President and General Manager, Industrial and Embedded IoT, Qualcomm Technologies, Inc., said:

At Embedded World, we’re eager to exhibit our cutting-edge technologies and work closely with our ecosystem partners to facilitate the development of innovative IoT products. We’re thrilled to unveil the RB3 Gen 2 Platform, tailored to deliver sophisticated on-device AI functionalities across various mid-tier IoT applications.

Stay tuned as we broaden our range of IoT offerings, introducing high-performance, industrial-grade solutions that will usher in a new era of intelligence, functional safety, and robust computing and I/O capabilities for the most challenging industrial applications.