MediaTek today announced the new Dimensity 920 and Dimensity 810 chipsets as the successor to the Dimensity 900 and Dimesnity 800 SoCs. The Dimensity 920 is built using the 6nm manufacturing node and offers a 9% boost in gaming performance compared to its predecessor, the Dimensity 900. It also has Arm Cortex-A78 cores up to 2.5GHz compared to 2.4GHz in the predecessor, while retaining other features.
MediaTek Dimensity 920 vs Dimensity 900 specifications
Processor | Dimensity 920 | Dimensity 900 |
Process | 6nm TSMC | |
CPU | 2x Cortex-A78 @ 2.5GHz 6x Cortex-A55 @ 2GHz |
2x Cortex-A78 @ 2.4GHz 6x Cortex-A55 @ 2GHz |
Memory | LPDDR4x, LPDDR5, UFS 2.1,UFS 2.2, UFS 3.1 | |
Camera | 20MP+20MP, 108MP, Hardware video HDR, 3X HDR-ISP, MFNR, 3DNR, AINR, Hardware Depth Engine, Warping Engine | |
Display | 2520 x 1080 (Full HD+) at 21:9 120Hz | |
Video Playback / Video Encode | H.264, H.265 / HEVC, VP-9, AV1 / H.264, H.265 / HEVC | |
Graphics | Mali-G68 MC4 | |
Modem | True Dual 5G SIM (5G SA + 5G SA) modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, 2×2 MIMO, 256QAM VoNR / EPS fallback | |
Connectivity | Integrated Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.2, GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC |
The Dimensity 810 is built using the 6nm high-performance manufacturing node, compared to 7nm in the DImensity 800 and 800U. It has Arm Cortex-A76 CPU speeds up to 2.4GHz and has camera features including artistic AI-color in collaboration with Arcsoft, and advanced noise reduction techniques for superb low-light photography.
MediaTek Dimensity 810 vs Dimensity 800 specifications
Processor | Dimensity 810 | Dimensity 800 |
Process | TSMC 6nm | TSMC 7nm |
CPU | 2x Cortex-A76 @ 2.4GHz 6x Cortex-A55 @ 2GHz |
4x Cortex-A76 @ 2GHz 4x Cortex-A55 @ 2GHz |
Memory | 2133MHz LPDDR4x up to 16GB, UFS 2.2 (2-lane) | 2133MHz LPDDR4x up to 16GB, UFS 2.1 |
Camera | 16MP+16MP, 64MP, Hardware video HDR, 2X HDR-ISP, MFNR, 3DNR, AINR, AI-Color, AI-Bokeh, Hardware Depth Engine, Warping Engine | 32MP+16MP, 80MP, HDR-ISP (3+1) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD |
Display | 2520 x 1080 (Full HD+) at 21:9 120Hz | |
Video Decode / Video Encode | 4K 60fps, H.264/265/VP9 / 4K 30fps, H.264/265 | |
Graphics | ARM Mali-G57 MC2 | Mali-G57 MC4 |
Modem | 2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA | |
Connectivity | Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.1, GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC | Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.1, GPS+Glonass+Beidou+Galileo, FM radio |
Additional features | Dual 5G SIM, 5G-CA (2CC 5G Carrier Aggregation), dual VoNR, MediaTek 5G UltraSave | 5G SA with VoNR, MediaTek 5G UltraSave |
The new MediaTek Dimensity 920 and Dimensity 810 powered 5G smartphones are expected to launch in Q3 2021. realme will launch the first phone with Dimensity 810 soon, and this is expected to be realme 8s which surfaced recently.