MediaTek Dimensity 920 and Dimensity 810 6nm SoCs with support for Dual SIM 5G, up to 120Hz FHD+ displays announced


MediaTek today announced the new Dimensity 920 and Dimensity 810 chipsets as the successor to the Dimensity 900 and Dimesnity 800 SoCs. The Dimensity 920 is built using the 6nm manufacturing node and offers a 9% boost in gaming performance compared to its predecessor, the Dimensity 900. It also has Arm Cortex-A78 cores up to 2.5GHz compared to 2.4GHz in the predecessor, while retaining other features.

MediaTek Dimensity 920 vs Dimensity 900 specifications

Processor Dimensity 920 Dimensity 900
Process 6nm TSMC
CPU 2x Cortex-A78 @ 2.5GHz
6x Cortex-A55 @ 2GHz
2x Cortex-A78 @ 2.4GHz
6x Cortex-A55 @ 2GHz
Memory LPDDR4x, LPDDR5, UFS 2.1,UFS 2.2, UFS 3.1
Camera 20MP+20MP, 108MP, Hardware video HDR, 3X HDR-ISP, MFNR, 3DNR, AINR, Hardware Depth Engine, Warping Engine
Display 2520 x 1080 (Full HD+) at 21:9 120Hz
Video Playback / Video Encode H.264, H.265 / HEVC, VP-9, AV1 / H.264, H.265 / HEVC
Graphics Mali-G68 MC4
Modem True Dual 5G SIM (5G SA + 5G SA) modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, 2×2 MIMO, 256QAM VoNR / EPS fallback
Connectivity Integrated Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.2, GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC

The Dimensity 810 is built using the 6nm high-performance manufacturing node, compared to 7nm in the DImensity 800 and 800U. It has Arm Cortex-A76 CPU speeds up to 2.4GHz and has camera features including artistic AI-color in collaboration with Arcsoft, and advanced noise reduction techniques for superb low-light photography.

MediaTek Dimensity 810 vs Dimensity 800 specifications

Processor Dimensity 810 Dimensity 800
Process TSMC 6nm TSMC 7nm
CPU 2x Cortex-A76 @ 2.4GHz
6x Cortex-A55 @ 2GHz
4x Cortex-A76 @ 2GHz
4x Cortex-A55 @ 2GHz
Memory 2133MHz LPDDR4x up to 16GB, UFS 2.2 (2-lane) 2133MHz LPDDR4x up to 16GB, UFS 2.1
Camera 16MP+16MP, 64MP, Hardware video HDR, 2X HDR-ISP, MFNR, 3DNR, AINR, AI-Color, AI-Bokeh, Hardware Depth Engine, Warping Engine 32MP+16MP, 80MP, HDR-ISP (3+1) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD
Display 2520 x 1080 (Full HD+) at 21:9 120Hz
Video Decode / Video Encode 4K 60fps, H.264/265/VP9 / 4K 30fps, H.264/265
Graphics ARM Mali-G57 MC2 Mali-G57 MC4
Modem 2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Connectivity Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.1, GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.1, GPS+Glonass+Beidou+Galileo, FM radio
Additional features Dual 5G SIM, 5G-CA (2CC 5G Carrier Aggregation), dual VoNR, MediaTek 5G UltraSave 5G SA with VoNR, MediaTek 5G UltraSave

The new MediaTek Dimensity 920 and Dimensity 810 powered 5G smartphones  are expected to launch in Q3 2021. realme will launch the first phone with Dimensity 810 soon, and this is expected to be realme 8s which surfaced recently.


Author: Srivatsan Sridhar

Srivatsan Sridhar is a Mobile Technology Enthusiast who is passionate about Mobile phones and Mobile apps. He uses the phones he reviews as his main phone. You can follow him on Twitter and Instagram