MediaTek Dimensity 900 6nm SoC with Dual SIM 5G, support for up to 120Hz FHD+ displays, 108MP camera announced

MediaTek today announced the new Dimensity 900 5G SoC, built on 6nm e TSMC’s 6nm process technology, same as Dimensity 1000 and 1200. It has Wi-Fi 6 connectivity, FHD+ 120Hz display support and a 108MP main camera. It has 5G New Radio (NR) sub-6GHz modem with carrier aggregation, True Dual SIM 5G (5G SA + 5G SA) and Voice over New Radio (VoNR) and support for bandwidth up to 120MHz. The octa-core central processing unit (CPU) consisting of two Arm Cortex-A78 processors with a clock speed of up to 2.4GHz and six Arm Cortex-A55 cores operating at up to 2GHz.

The chipset has an Arm Mali-G68 MC4 graphics processing unit (GPU), along with an independent artificial intelligence (AI) processing unit (APU). The 3rd generation of MediaTek’s AI processing unit supports a wide variety of AI applications and 4K high definition resolution (HDR).

Key cutting-edge technologies integrated into the Dimensity 900 include:

  • MediaTek’s Imagiq 5.0: The chipset integrates a flagship-class, HDR-native image signal processor (ISP) and incorporates a unique hardware-accelerated 4K HDR video recording engine. This supports up to four concurrent cameras and up to 108MP sensors.
  • MediaTek’s MiraVision: The chipset packs upgraded video capabilities from a standard dynamic range (SDR) to HDR with real-time enhancements of HDR10+ video playback to improve color and contrast of content.
  • Premium AI-Camera Enhancements: Smartphones powered by the Dimensity 900 will capture every detail with support for up to 108MP cameras with 32M at 30fps and multi-camera options such as 20+20MP. The chipset integrates our AI processing unit with ultra-efficient INT8, INT16 and accurate FP16 capabilities to deliver premium and super precise AI-camera results.

MediaTek Dimensity 900 vs Dimensity 1100 specifications

Processor Dimensity 900 Dimensity 1100
Process 6nm TSMC
CPU 2x Cortex-A78 @ 2.4GHz
6x Cortex-A55 @ 2GHz
4x Cortex-A78 @ 2.6GHz
4x Cortex-A55 @ 2GHz
Memory LPDDR4x, LPDDR5, UFS 2.1,UFS 2.2, UFS 3.1 2X LPDDR4x, up to 16GB, dual-channel UFS 3.1
Camera 20MP+20MP, 108MP, Hardware video HDR, 3X HDR-ISP, MFNR, 3DNR, AINR, Hardware Depth Engine, Warping Engine 32MP+16MP, 108MP, Multi-Camera, HDR-ISP (3+2) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD
Display 2520 x 1080 (Full HD+) at 21:9 120Hz 2520 x 1080 (Full HD+) at 21:9 144Hz, QHD+ at 90Hz
Video Playback / Video Encode H.264, H.265 / HEVC, VP-9, AV1 / H.264, H.265 / HEVC
Graphics Mali-G68 MC4 Mali-G77 MC9
Modem True Dual 5G SIM (5G SA + 5G SA) modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, 2×2 MIMO, 256QAM VoNR / EPS fallback
Connectivity Integrated Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.2, GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC

Devices powered by MediaTek Dimensity 900 are expected to be launched in the global market in Q2 2021.

Author: Srivatsan Sridhar

Srivatsan Sridhar is a Mobile Technology Enthusiast who is passionate about Mobile phones and Mobile apps. He uses the phones he reviews as his main phone. You can follow him on Twitter and Instagram