MediaTek Helio X30 10nm Deca-Core SoC with support for up to 8GB LPDDR4X RAM coming to smartphones in Q2 2017

MediaTek Helio X30

MediaTek officially introduced its flagship Helio X30 Deca-Core processor at an event in China and detailed its specifications back in September last year. Today it has revealed even more specifications of the SoC at the MWC 2017. It has 50% power savings and a 35% increase in performance from MediaTek’s previous generation chipset.

It is based on 10nm TSMC process. This increases performance by up to 22% and saves power by up to 40% versus 16nm generation products, said the company. It has 10-Core, Tri-Cluster architecture built for extreme performance: two ARM Cortex-A73 at 2.5 GHz, four ARM Cortex-A53 at 2.2 GHz and four ARM Cortex-A35 at 1.9 GHz.

MediaTek said that it is industry’s first mobile SoC to bring a power-efficient, hardware based 4K2K 10-bit HDR10 video decoding to smartphones.

X20 X30
Process 20nm 10nm
Apps CPU 2x Cortex-A72 @ 2.1GHz ~ 2.3GHz
4x Cortex-A53 @ 1.85GHz
4x Cortex-A53 @ 1.4GHz
2x Cortex-A73 @ 2.5GHz
4x Cortex-A53 @ 2.2GHz
4x Cortex-A35 @ 1.9GHz
Memory 2x 32-bit LPDDR3 (Max 4GB) 933MHz, eMMC 5.1 4 x 16-bit LPDDR4X (Max 8GB) 1866MHz, eMMC 5.1, UFS 2.1
Camera 25MP @ 30 fps (Dual ISP) 16MP+16MP @ 30 fps (Dual ISP) 14 bit Vision processor @ 550 Mhz
Video Decode 4Kx2K 10 bit 30fps H.264/265/VP9 4Kx2K 10 bit 30fps H.264/265/VP9
Video Encode 4Kx2K 30fps H.265 w/HDR 4Kx2K 30fps H.265 w/VP9
Graphics ARM Mali-T880 MP4 700MHz PowerVR Series7XT Plus 800MHz
Display WQXGA 2560×1600 60fps
FHD 1920×1080 120fps
w/12 HW Blending Layer
WQXGA 2560×1600 60fps
FHD 1920×1080 120fps
w/12 HW Blending Layer
Audio 110dB SNR & -95dB THD 120dB SNR & -100dB THD (MT6337) Audio DSP Cortex-M4 420 Mhz
Sensor Processor Cortex-M4 364MHz Cortex-M4 420MHz
Modem LTE FDD/TDD R11 Cat-6 with 2x CA LTE FDD/TDD R12 Cat. 10 with 3x DL CA
Connectivity Integrated Wi-Fi 802.11ac GPS/Glonass/Beidou ANT+, BT/FM External 2 x2 11 ac
Integrated Wi-Fi 802.11ac GPS/Glonass/Beidou ANT+, BT/FM
VoLTE, ViLTE, Wi-Fi calling, Ultra HD Voice (EVS), RCS. LTE-U/LWA bands.

It also has MediaTek’s newest version of CorePilot 4.0 technology that incorporates intelligent task scheduling system, thermal management and user experience monitoring systems.

CorePilot 4.0 is built on MediaTek’s Tri-Cluster processing architecture. The three clusters offer minimum, medium and maximum processor levels to better balance the vast needs and requirements of smartphone applications and tasks.

This combination can predict an individual’s power usage scenario on the device and prioritize which application is most critical at that point in time to control power consumption. This translates to longer device battery life and stronger performance that makes the most of the Helio X30’s 10-core architecture.

The MediaTek Helio X30 is now under mass production and smartphones powered by the chipset will be available in Q2 2017.

Author: Srivatsan Sridhar

Srivatsan Sridhar is a Mobile Technology Enthusiast who is passionate about Mobile phones and Mobile apps. He uses the phones he reviews as his main phone. You can follow him on Twitter and Instagram