At its Samsung Networks: Redefined virtual event, Samsung introduced new chipsets that will be used in its next generation 5G solutions. The new 3GPP Rel.16 compliant chipsets consist of a third generation mmWave Radio Frequency Integrated Circuit (RFIC) chip, a second generation 5G modem System-on-Chip (SoC) and a Digital Front End (DFE)-RFIC integrated chip. Continue reading “Samsung introduces new chipsets for next-gen 5G lineup and One Antenna Radio to accelerate 5G rollouts”