MediaTek Dimensity 7300 and Dimensity 7300X 4nm SoCs announced

MediaTek has introduced Dimensity 7300, another 7000 series chipset, as the successor to last year’s Dimensity 7050. There is also Dimensity 7300X designed for flip-style foldable devices with support for dual displays.

Both these octa-core SoCs pack 4X Arm Cortex-A78 cores at up to 2.5GHz paired with 4X Arm Cortex-A55 cores. Compared to 6nm process in the Dimensity 7050, these use 4nm process provides up to 25% lower power consumption compared to the predecessor.

There is Arm Mali-G615 GPU and MediaTek HyperEngine for gaming. In comparison to competitor alternatives, the Dimensity 7300 series offers 20% faster FPS and 20% improved energy efficiency, said the company.

These feature smart resource optimization, optimize 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.

The Dimensity 7300 chipsets feature MediaTek Imagiq 950, featuring a 12-bit HDR-ISP with support for a 200MP main camera, new hardware engines providing precise noise reduction (MCNR), face detection (HWFD), and video HDR.

Live focus photo performance is up to 1.3X faster and photo remastering is up to 1.5X faster than the Dimensity 7050, says the company. MediaTek APU 655 promises twice the AI performance of the Dimensity 7050.

Processor Dimensity 7300 / 7300X Dimensity 7050
Process 4nm-class TSMC 6nm-class
CPU 4x Cortex-A78 @ 2.5GHz 4x Cortex-A55 @ 2GHz 4x Cortex-A78 @ 2.6GHz
4x Cortex-A55 @ 2GHz
Memory LPDDR5 / LPDDR4x up to 6400Mbps, UFS 3.1 LPDDR5 / LPDDR4x, UFS 3.1 / UFS 2.1
Camera Imagiq 950 ISP, 12-bit HDR-ISP, Hardware Face Detection Hardware MCNR 4K Video HDR AI-3A with AE, AWB, AF Video EIS Dual simultaneous video capture All-pixel AF Imagiq ISP, Max Camera ISP 200MP, Hardware HDR video, 3X HDR-ISP, MFNR, 3DNR, AINR, Hardware Depth Engine, Warping Engine
Display WFHD+ @ 120Hz Full HD+ @ 144Hz, Dual display support (7300X) 2520 x 1080 at 120Hz
Video Playback / Video Encode H.264, HEVC, VP-9 HEVC, H.264
Graphics Arm Mali-G615 MC2 Arm Mali-G68 MC4
APU MediaTek 6th generation APU 655 MediaTek APU 3.0
Modem 2G-5G Multi-Mode, 5G/4G CA, 5G/4G FDD / TDD, CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, GSM, TD-SCDMA, WDCDMA SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD and FDD bands, DSS, NR DL 3CC 140MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 2×2 MIMO, 256QAM VoNR / EPS fallback
Connectivity Integrated Wi-Fi 6E (a/b/g/n/ac/ax) 2T2R, Bluetooth 5.4, GPS BeiDou Glonass Galileo QZSS NavIC Integrated Wi-Fi 6 (a/b/g/n/ac/ax) 2T2R, Bluetooth 5.2, GPS L1CA+L5 BeiDou B1I+ B2a Glonass L1OF Galileo E1 + E5a QZSS L1CA+ L5 NavIC

MediaTek has not revealed which phone will use the chip first, but based on earlier reports, motorola razr 50 that is expected to launch in June will use the Dimensity 7300X SoC first.

Author: Srivatsan Sridhar

Srivatsan Sridhar is a Mobile Technology Enthusiast who is passionate about Mobile phones and Mobile apps. He uses the phones he reviews as his main phone. You can follow him on Twitter and Instagram