MediaTek Helio P70 Octa-Core 12nm processor with improved multi-core AI processing, Dual 4G VoLTE announced


MediaTek just introduced Helio P70 12nm TSMC FinFET technology, successor of the Helio P60 that was introduced at the MWC earlier this year.It  is built with TSMC’s 12nm FinFET technology, same as the predecessor, but this comes with multi-core APU operating at up to 525 MHz for fast and efficient edge-AI processing. The AI engine delivers a 10 to 30% AI processing boost compared to the Helio P60, says the company.

It has a slightly over clocked ARM Cortex-A73 2.1 GHz CPUs and four ARM Cortex-A53 2.0 GHz CPUs in an Octa-core big.LITTLE configuration as the P60. It has ARM Mali-G72 MP3 GPU operating at up to 900 MHz, which promises a 13% performance improvement, compared to the Helio P60. “In popular games that frequently generate a heavy load across the SoC, the P70 provides 7% better DOU and up to 35% lower power versus the P60,” says the company. It has support for 20:9 displays at Full HD+ resolution.

MediaTek’s AI video encoder enhances video call quality even when connection bandwidth is limited. It can be used for video calls including Skype calls, Facebook video calls and Youtube live video streaming. It has improved deep-learning facial detection that promises up to 90% accuracy. It has Dual 4G VoLTE support and the MediaTek’s smart antenna technology automatically uses the best antenna combination to sustain signal quality.

“Its three ISPs are tuned to provide significant power savings, reducing consumption by 18% compared to previous Helio generation dual-camera setups says MediaTek.

 Helio P70  Helio P60
Process TSMC 12nm TSMC 12nm
Apps CPU 4x Cortex-A73 @ 2.1 GHz
4x Cortex-A53 @ 2.0 GHz
4x Cortex-A73 @ 2.0 GHz
4x Cortex-A53 @ 2.0 GHz
Memory 1X LPDDR3 933MHz, 2X LPDDR4x Up to 1800MHz up to 8GB (LPDDR4x), eMMC 5.1 / UFS 2.1 1X LPDDR3 933MHz, 2X LPDDR4x Up to 1800MHz up to 8GB (LPDDR4x), eMMC 5.1 / UFS 2.1
Camera 24+16MP or 32MP camera @ 30fps. (AI) Facial Detection & Scene Detection; Hardware Warping Engine (EIS); Anti-Blooming Engine; MEMA 3DNR; Multi-Frame Noise reduction; Real-time HDR recording and viewing; Zig-Zag HDR; RAW-domain multi-frame HDR; PDAF 16+20MP or 32MP camera @ 30fps. (AI) Facial Detection & Scene Detection; Hardware Warping Engine (EIS); Anti-Blooming Engine; MEMA 3DNR; Multi-Frame Noise reduction; Real-time HDR recording and viewing; Zig-Zag HDR; RAW-domain multi-frame HDR; PDAF
Video Decode 2160p (2160 x 1080), h.264, h.265 / HEVC at 30 fps 2160p (2160 x 1080), h.264, h.265 / HEVC at 30 fps
Video Encode 2160p h.264 at 30 fps 2160p h.264 at 30 fps
Graphics ARM Mali-G72 MP3 at up to 900MHz ARM Mali-G72 MP3 at up to 800MHz
Modem Cat-7 DL / Cat-13 UL, 2×2 UL CA, TAS 2.0, HUPE, IMS (VoLTE\ViLTE\WoWi-Fi), eMBMS, Dual 4G VoLTE (DSDS), Band 71 Cat-7 DL / Cat-13 UL
2×2 UL CA, TAS 2.0, HUPE, IMS (VoLTE\ViLTE\WoWi-Fi), eMBMS, Dual 4G VoLTE (DSDS), Band 71
Connectivity Integrated Wi-Fi 802.11 ac GPS/Glonass/Beidou ANT+, Bluetooth 4.2 /FM Integrated Wi-Fi 802.11 ac GPS/Glonass/Beidou ANT+, Bluetooth 4.2 /FM

The Helio P70 is in production now, and is expected to be available in smartphones by November of this year.


Author: Srivatsan Sridhar

Srivatsan Sridhar is a Mobile Technology Enthusiast who is passionate about Mobile phones and Mobile apps. He uses the phones he reviews as his main phone. You can follow him on Twitter and Instagram