Huawei hinted a possible phone launch last week by sending press invites for IFA in Berlin. Today, a leaked photo is suggesting that the company will add a metal back to the Huawei Ascend D3.
As per the leaked photo, it looks like the rear panel of the phone is made out of metal. Ascend D3 is a successor to the Ascend D2 that was launched in January 2013. In addition to the metal plate, it looks like Huawei will also add a finger print scanner to the phone. The leaked photo shows a three cutouts on the rear back panel of which two are most likely for camera and flash. However, the third one can be for a fingerprint scanner. There is a strong possibility that the it could be for something else.
The Ascend D3 will most likely be unveiled next month at IFA, and is rumored to feature a 6-inch (1920 x 1080) display, a homegrown Huawei octa-core HiSilicon Kirin 920 processor, 2 GB of RAM, 16 GB of internal memory, 13 MP rear camera, 5 MP front-facing camera, and will run on Android 4.4 KitKat.
via:PhoneArena