Samsung Electronics is reportedly developing a new advanced packaging technology for its upcoming mobile application processor (AP), the Exynos 2600, according to ZDNET Korea. This innovation aims to integrate heat-dissipating materials directly within the semiconductor package, potentially enhancing the performance of next year’s Galaxy S26 smartphone series.
Samsung is said to be actively engaged in research and development to implement a Heat Pass Block (HPB) in the Exynos 2600.
This AP is being developed based on Samsung’s proprietary 2-nanometer (nm) process and is designed as a system-on-chip (SoC), combining CPU, GPU, and NPU into a single unit. It is slated for inclusion in Samsung’s flagship Galaxy S26 series, expected to launch next year. Like the Galaxy S24, the S26 could come with Exynos or Snapdragon chips, depending on the market.
The decision to incorporate HPB within the package is intended to improve the Exynos 2600’s performance. The HPB is a copper-based heatsink. Unlike previous Exynos models that used a package-on-package (PoP) structure with DRAM stacked on top of the AP, the HPB will be integrated alongside the DRAM directly onto the AP. This configuration is designed to absorb heat generated by the AP more effectively.
Samsung aims to complete quality testing for the Exynos 2600 with this new technology by October. Successful development could lead to immediate mass production for the Galaxy S26 series.