Samsung has confirmed Exynos 2600, the company’s next flagship chip, as the successor to Exynos 2500 which was introduced earlier this year.
“In Silence, We listened. Refined at the Core. Optimized at every level. To express the exceptional. The next Exynos is coming. It’s time to express the exceptional,” says the company without revealing any other details.
Based on earlier rumours, the Exynos is said to use Samsung’s proprietary 2-nanometer (nm) process designed as a system-on-chip (SoC), combining CPU, GPU, and NPU into a single unit. Samsung is said to use Heat Pass Block (HPB) within the package to improve the performance.
Unlike previous Exynos models that used a package-on-package (PoP) structure with DRAM stacked on top of the AP, the HPB will be integrated alongside the DRAM directly onto the AP. This configuration is designed to absorb heat generated by the AP more effectively.
The Samsung Exynos 2600 is said to power Galaxy S26 and S26+ models that are said to launch at the Galaxy Unpacked event in San Francisco on February 25, 2026. We should know more details about the chip in the coming weeks since the chip is expected to launch sometime in January 2026, a month before the debut in the phones.