Government approves 23 DLI-backed semiconductor projects for startups and MSMEs


The Government of India has sanctioned 23 chip-design projects under the Design Linked Incentive (DLI) Scheme to strengthen domestic semiconductor design capabilities.

According to the Ministry of Electronics & IT (MeitY), the projects—driven by startups and MSMEs—will develop indigenous chips and System-on-Chip (SoC) solutions for applications such as surveillance cameras, energy meters, microprocessor IPs, and networking systems.

MeitY also confirmed that 72 companies have gained access to Electronic Design Automation (EDA) tools, enabling them to progress with industry-standard resources for chip development.

Vervesemi Microelectronics: Part of India’s DLI and C2S Programs

Vervesemi Microelectronics, a fabless semiconductor company founded in 2017, is part of the first cohort of firms approved under the DLI Scheme and the Chips to Startup (C2S) programme.

The company develops high-performance analog IPs and ASICs, spanning five foundries and more than 20 technology nodes. Its portfolio includes 110+ IPs, 25 IC SKUs, 10 patents, and 5 trade secrets, with applications in 5G, Wi-Fi 6/7, energy, aerospace, defense, industrial automation, and smart energy.

Key milestones include:

  • Among the first Indian companies to export semiconductor intellectual property (IPs) globally.
  • Its proprietary analog chain IPs, enhanced with machine learning, are already used in products by global manufacturers.
  • Trusted for solutions in mission-critical and high-reliability systems.
Vervesemi Roadmap: Volume Production from 2026–27

Vervesemi is targeting volume production of multiple ICs and SoCs by late 2026 / early 2027, with projects supported under both DLI and C2S.

Upcoming ICs and ASICs

  • BLDC Controller ASIC (C2S Programme): For small motor applications such as fans and appliances. Samples expected in 2026.
  • Precision Motor-Control ASIC (DLI-recognized): Designed for EVs, drones, and industrial automation. Samples expected in 2026.
  • Multifunction Data Acquisition ASIC: Developed for space and avionics. Engineering samples expected in 2026.
  • Weighing Scale & Bridge Sensor ASIC: Designed for weighing applications and Force Touch devices, this IC will be sampled by the close of 2025.
  • Smart Energy Metering ASIC: Designed in India for ultra-accurate, high-speed energy measurement with Class 0.2S compliance. Samples expected by end-2025.

Intelligence Built Into Every Chip

Each IC from Vervesemi incorporates ML technology to provide:

  • Self-healing systems
  • Fail-safe reliability
  • Improved fabrication yields
  • Higher efficiency and precision

This approach supports the development of designed-in-India semiconductors for critical sectors worldwide.

India’s Semiconductor Vision

Smt. Sunita Verma, Group Coordinator (R&D) at MeitY, emphasized that India is working towards becoming a world leader in semiconductor design, with the ambition that one day every device could carry a “designed-in-India” chip.

Speaking on the developments, Rakesh Malik, Founder & CEO of Vervesemi, said:

These innovations represent a milestone for India’s semiconductor ecosystem. By producing high-performance, Made-in-India ICs for strategic and consumer markets, we are not only advancing import substitution but also demonstrating India’s capability to lead on the global semiconductor stage.

Commenting about the developments, Pratap Narayan Singh, Founder & CTO of Vervesemi Microelectronics, said:

At Vervesemi, we combine advanced signal-chain design with machine learning to provide fault tolerance, adaptive calibration, and predictive diagnostics. Our multi-channel data acquisition and industrial application ICs establish new benchmarks in precision, efficiency, and reliability across aerospace, industrial, and consumer markets.