Google Pixel 10’s Tensor G5 chip will be made by TSMC, marking Google’s first chip made without Samsung. The Tensor G4 for the upcoming Pixel 9 will still be made by Samsung, with minor improvements, according to Android Authority.
They found evidence in public trade databases, confirming the rumors and providing details on the new chip. The shipping manifest for a Tensor G5 sample chip includes “LGA,” the codename “Laguna Beach.”
Previously, Google used abbreviations like “WHI” for Whitechapel (Tensor G1) and “ZPR” for Zuma Pro (Tensor G4). The manifest mentions TSMC and InFO POP, a packaging technology unique to TSMC, supporting the rumor. It includes:
- The chip is marked as revision “A0,” indicating it’s an early version with expected future revisions.
- “OTP, V1” shows it’s the first version of the one-time programmable data, allowing Google to modify chip parameters without changing its structure.
- “NPI-OPEN” indicates an early sample, still in the New Product Introduction phase, meaning manufacturing steps are being refined.
The passed tests, including the SLT (system-level test), show basic functionality. The chip, about 16 months from release, requires early sampling to ensure the platform is ready in time.
The entry also reveals the chip has 16GB of package-on-package RAM from Samsung Electronics Co., aligning with leaks about the Pixel 9 Pro’s upgraded RAM.
Google LLC in Taiwan is listed as the exporter, with Tessolve Semiconductor in India as the importer. Tessolve specializes in semiconductor solutions, suggesting Google is outsourcing work previously done by Samsung.
While the Pixel 9 has yet to be released, the switch to a TSMC-manufactured chip for the Pixel 10 indicates promising improvements for future devices.
Tensor G4’s detailed performance and specifications will be revealed closer to its expected launch in October this year.