Samsung and AMD have announced the signing of a Memorandum of Understanding (MOU) to broaden their strategic partnership concerning next-generation artificial intelligence (AI) memory and computing technologies.
The agreement was formally signed at Samsung’s semiconductor manufacturing complex in Pyeongtaek, South Korea. The ceremony was attended by Dr. Lisa Su, Chair and CEO of AMD, and Young Hyun Jun, Vice Chairman and CEO of Samsung Electronics.
AMD Instinct MI455X GPU to use Samsung HBM4 memory
Under the terms of the MOU, Samsung will serve as the primary supplier of HBM4 memory for AMD’s upcoming AI accelerator, the AMD Instinct MI455X GPU. The collaboration also includes the development of advanced DRAM solutions—specifically high-performance DDR5 memory—optimized for the 6th Generation AMD EPYC CPUs, internally codenamed “Venice.”
These combined memory and processing technologies are designed to support next-generation AI systems, including rack-scale architectures like the AMD Helios platform. The companies noted that the collaboration aims to address the increasing requirements for memory bandwidth and power efficiency in modern AI and data center workloads.
Samsung HBM4 memory
Samsung’s HBM4 memory, which has entered mass production, is manufactured using the company’s 6th-generation 10-nanometer-class (1c) DRAM process and features a 4nm logic base die. According to Samsung, the HBM4 memory provides processing speeds of up to 13 gigabits-per-second (Gbps) and a maximum bandwidth of 3.3 terabytes-per-second (TB/s).
AMD Instinct MI455X GPU
The AMD Instinct MI455X GPU, utilizing this HBM4 memory, is positioned to handle high-performance tasks such as AI model training and inference. The GPU will function as a core component of the AMD Helios rack-scale architecture, which focuses on performance scalability for AI infrastructure.
In addition to memory supply and optimization, the MOU indicates that Samsung and AMD will explore opportunities for a foundry partnership. Under such an arrangement, Samsung would potentially provide semiconductor manufacturing services for future AMD products.
This recent agreement extends a nearly two-decade relationship between Samsung and AMD, which has spanned mobile, graphics, and computing technologies. Most recently, Samsung served as the primary HBM3E memory supplier for AMD’s current generation of AI accelerators, the Instinct MI350X and MI355X.
Commenting on this, Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics, said:
Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration. From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and advanced packaging, Samsung is uniquely positioned to deliver unrivaled turnkey capabilities that support AMD’s evolving AI roadmap.
Dr. Lisa Su, Chair and CEO of AMD, said:
Powering the next generation of AI infrastructure requires deep collaboration across the industry. We are thrilled to expand our work with Samsung, bringing together their leadership in advanced memory with our Instinct GPUs, EPYC CPUs and rack-scale platforms. Integration across the full computing stack, from silicon to system to rack, is essential to accelerating AI innovation that translates into real-world impact at scale.