MediaTek just announced Dimensity 9500, the company’s latest flagship SoC, as the successor to Dimensity 9400 / 9400+ as it had announced. It uses third-generation TSMC’s 3nm process tech and the third-generation all-large core CPU architecture.
Compared to the previous generation, the Dimensity 9500 flagship chip all-new C1-Ultra core, boasting a 10% increase in IPC over the previous generation. It also features C1-Premium and C1-Pro cores.
CPU
The MediaTek Dimensity 9500 has a 4.21GHz C1 ultra core, three premium C1 cores at 3.5GHz, and four C1 Pro performance cores, with four-lane UFS 4.1 storage.
This design promises up to 32% higher single-core and 17% higher multi-core performance compared to the previous generation, while the ultra core achieves up to 55% lower power consumption at peak performance, giving users longer battery life and greater productivity, says MediaTek.
The 9500 is also up to 30% more power efficient while multitasking in games and social audio call apps, adds the company.
The platform’s new cache and memory architecture, including the industry’s first support for 4-channel UFS4.1, doubles read/write speeds and accelerates large AI model loading by 40%. The second-generation Dimensity Scheduling Engine translates this raw power into smoother responsiveness and sustained efficiency, even under heavy workloads.
GPU
The Dimensity 9500 integrates a new Arm G1-Ultra GPU promising up to 33% higher peak performance and 42% improved power efficiency, and introduces higher frame rate interpolation up to 120FPS ray tracing.
MediaTek’s collaboration with leading studios, along with support for MegaLights in Unreal Engine 5.6 and Nanite in Unreal Engine 5.5, enable AAA-level real-time rendering and immersive lighting effects, said the company.
NPU
The Dimensity 9500 integrates the ninth-generation MediaTek NPU 990 with Generative AI Engine 2.0 doubles compute power and introduces BitNet 1.58-bit large model processing, reducing power consumption by up to 33%.
Doubling its integer and floating-point computing capabilities, users benefit from 100% faster 3 billion parameter LLM output, 128K token long text processing, and the industry’s first 4k ultra-high-definition image generation; all while slashing power consumption at peak performance by 56%, said the company.
The Dimensity 9500 is the first to support an integrated compute-in-memory architecture for its newly-added Super Efficient NPU, significantly reducing power consumption and enabling AI models to run continuously. This advancement further enhances end-user experiences with more sophisticated proactive AI.
ISP
With MediaTek Imagiq 1190, the MediaTek Dimensity 9500 supports RAW-domain pre-processing, up to 200MP capture, 30fps continuous focus tracking, and new portrait engine, while enabling cinematic 4K 60FPS portrait video.
This offers Android’s first 4K120 Dolby Vision video capture with EIS. The latest MiraVision Adaptive Display technology, which dynamically adjusts contrast and color saturation based on ambient lighting, panel characteristics, and real-time content analysis.
This ensures a clear viewing experience both outdoors in high-brightness scenarios — without overheating during prolonged use — and indoors in extremely dark environments, providing eye protection while maintaining clarity.
Connectivity
The platform’s connectivity suite includes Bluetooth call enhancement, Wi-Fi fast transfer, and multi-network intelligence for seamless calls and data. AI-powered communication technologies deliver up to 10% lower power in 5G and 20% lower power in Wi-Fi scenarios, while 5CC carrier aggregation boosts bandwidth by 15%.
AI positioning and network selection technologies offer 20% higher accuracy, as well as 50% lower network latency thanks to AI congestion prediction.
MediaTek Dimensity 9500 specifications
- 1x Arm C1-Ultra, 2MB L2 cache, 3x Arm C1-Premium, 1MB L2 cache, 4x Arm C1-Pro, 512KB L2 cache
- 16MB L3 cache+ 10MB SLC
- Arm Mali-G1 Ultra MC12 GPU
- MediaTek NPU 990 (Generative AI, Agentic AI)
- TSMC’s third generation 3nm process
- WQHD+ at 180Hz, Tri-port MIPI for Tri-Fold Displays
- Up to 320MP camera, Imagiq 1190
- 3GPP-R17, Sub-6GHz (FR1), 2G-5G multi-mode, 5G-CA, 4G-CA, 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM
- 5G/4G Dual SIM Dual Active, Dual Data, SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR FR1 TDD+FDD, DSS, 256QAM VoNR / EPS fallback
- GPS L1CA+L5+L1C, BeiDou B1I+ B1C + B2a +B2b, Glonass L1OF, Galileo E1 + E5a + E5b, QZSS L1CA + L5, NavIC L5 + L1
- Wi-Fi 7 (a/b/g/n/ac/ax/be), Triple Band Triple Concurrency (TBTC), Bluetooth 6.0 with dual Bluetooth engine, 12Mbps
- LPDDR5X 10667 9600Mbps memory up to 10.7Gbps,UFS 4 + MCQ
Availability
vivo X300 series that will be introduced in China on October 13th will be the first to use the Dimensity 9500 flagship chip. The vivo X300 series will feature V3+ imaging chip. It promises stronger performance, better energy efficiency, and deeper image fusion.
OPPO has also confirmed that its Find X9 series which will be introduced on October 16th will use the Dimensity 9500 flagship chip.
Commenting on the new chip, JC Hsu, corporate senior vice president at MediaTek and general manager of the Wireless Communications Business Unit, said:
As AI becomes part of everyday life, consumers want devices that feel smarter, faster, and more personal without sacrificing battery life. The MediaTek Dimensity 9500 delivers exactly that: Breakthrough on-device AI, top-tier performance and efficiency, and a full suite of premium experiences that our partners can bring to users around the world.