MediaTek Dimensity CX C10 Max 3nm SoC for ultra-thin, premium Googlebook announced

MediaTek has announced the Dimensity CX C10 Max, the debut system-on-chip (SoC) in its new Dimensity Compute Experiences (CX) family. Fabricated on TSMC’s 3nm process node, the flagship processor is targeted at premium, ultra-portable computing devices, specifically an upcoming Googlebook hardware platform.

The platform is designed around an all-big-core architecture paired with dedicated silicon for neural processing, graphics, and image signaling.

Architectural Configuration and Performance

The Dimensity CX C10 Max uses an octa-core CPU layout composed entirely of performance cores. The cluster includes:

  • 1× Arm Cortex-X925 running at up to 3.73 GHz with 2MB L2 cache
  • 3× Arm Cortex-X4 cores with 1MB L2 cache each
  • 4× Arm Cortex-A720 cores with 512KB L2 cache each

Memory hierarchy includes a 12MB shared L3 cache and 10MB of system-level cache (SLC). Memory and storage support scales up to LPDDR5X at data rates of 9600 Mbps and UFS 4.0 storage interfaces.

Graphics processing is handled by an 11-core Arm Immortalis-G925 MC11 GPU. The integrated display engine supports internal panels up to 4K resolution at 60Hz via DisplayPort/MIPI, as well as dual external 4K displays through DisplayPort Multi-Stream Transport (MST). Video decode supports 10-bit 4K60 streams across HEVC, AVC, VP9, and AV1 formats, while encoding handles 4K60 in 10-bit and 8-bit HEVC and AVC.

Because of the 3nm manufacturing process and thermal design targets, the chip is intended to support thin, light, and fanless form factors capable of sustained all-day battery operation.

Dedicated AI Acceleration and Camera ISP

On-device machine learning tasks are routed to the integrated MediaTek NPU 890, rated for up to 55 TOPS (dense compute). The NPU supports INT8, INT16, FP16, and BF16 precision formats to handle both generative and agentic AI workloads. MediaTek designed the unit to accelerate Gemini Intelligence functions locally, reducing latency and reliance on cloud processing for select automated and predictive assistant features.

Imaging and video tasks rely on the Imagiq 1090 ISP, which accommodates sensors up to 32MP. The ISP provides hardware-level electronic image stabilization (EIS), high dynamic range (HDR) video capture, automatic zoom, and continuous tracking autofocus to optimize camera output for video calls and content creation.

Technical Specifications
Subsystem Specification
Process Node TSMC 3nm
CPU Configuration Octa-core (1× Cortex-X925 @ 3.73 GHz, 3× Cortex-X4, 4× Cortex-A720)
Cache 2MB L2 (prime), 1MB L2 each (mid), 512KB L2 each (efficiency), 12MB L3, 10MB SLC
GPU Arm Immortalis-G925 MC11
NPU MediaTek NPU 890 (up to 55 TOPS; INT8, INT16, FP16, BF16 support)
Memory Support LPDDR5X up to 9600 Mbps
Storage Support UFS 4.0
Display Support Internal: Up to 4K60 (DP/MIPI); External: Dual 4K (DP/MST)
Camera / ISP Imagiq 1090 ISP, up to 32MP, HDR video, EIS, Auto Zoom
Connectivity Wi-Fi 7 (up to 7.3 Gbps), dual-engine Bluetooth 6.0
Wireless Subsystems and Platform Deployment

For local networking and peripheral support, the Dimensity CX C10 Max integrates Wi-Fi 7, providing peak theoretical transfer speeds of up to 7.3 Gbps. It also incorporates dual-engine Bluetooth 6.0 connectivity to improve link stability and latency for external accessories, wireless audio, and input peripherals.

The release of the Dimensity CX C10 Max marks MediaTek’s expansion into dedicated premium computing architectures, establishing an ARM-based hardware foundation aimed directly at ChromeOS/Googlebook devices requiring local neural compute and fanless designs.


Srivatsan Sridhar: Srivatsan Sridhar is a Mobile Technology Enthusiast who is passionate about Mobile phones and Mobile apps. He uses the phones he reviews as his main phone. You can follow him on Twitter and Instagram
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