MediaTek has officially announced the Dimensity 9600 Pro, a flagship mobile system-on-chip (SoC) manufactured on a 2nm process node as the successor to Dimensity 9500.
Alongside the flagship silicon, the company introduced the Dimensity 9600M, a secondary tier intended to broaden access to its latest architecture. Both platforms are scheduled to debut in commercial smartphones later this quarter.
CPU Architecture and Memory Subsystem
The Dimensity 9600 Pro utilizes an “All Big Core” layout arranged in an octa-core (2+3+3) cluster configuration:
- High-Performance Cluster: 2x Arm C2-Ultra cores (up to 4.55 GHz, 2MB L2 cache each)
- Mid-Performance Cluster: 3x Arm C2-Pro cores (up to 4.35 GHz, 1MB L2 cache each)
- High-Efficiency Cluster: 3x Arm C2-Pro cores (up to 3.1 GHz, 512KB L2 cache each)
The CPU architecture is supported by 16MB of L3 cache and 10MB of System Level Cache (SLC), contributing to a combined 34.5MB cache pool. MediaTek claims the chip delivers up to 17% higher single-core performance, 15% higher multi-core performance, and a 61% reduction in multi-core power consumption compared to the previous generation.
For memory and storage, the platform adopts next-generation UFS 5.0 alongside compatibility with LPDDR6 (up to 10,667 MT/s) and LPDDR5X (up to 10,667 MT/s).
AI Processing Engine
Machine learning tasks are managed by a dual-NPU architecture paired with the Dimensity Agentic AI Engine. The primary MediaTek NPU 1090 is built to run local large language models up to 30B parameters, yielding a stated 51% increase in LLM prefill performance and 55% higher token generation per watt. It is accompanied by the Super Efficient NPU 2.0, which reduces power consumption by 40% for always-on perception tasks.
Graphics, Display, and Cameras
Graphics rendering is handled by the Arm Mali-G2 Ultra NX GPU, which delivers up to 27% higher peak performance, 24% lower peak power draw, and an 18% improvement in ray tracing. The GPU interfaces directly with the display controller to support panels up to WQHD+ resolution at 180Hz, alongside Tri-port MIPI integration designed for tri-fold form factors. Multimedia capabilities include BT.2020 color pipeline output, hardware video decode up to 8K60 (VVC/H.266, HEVC, AVC, VP9, AV1), and video encode up to 8K60 in 8-bit HEVC or 8K30 in 10-bit HEVC/AVC.
Imaging is driven by the Imagiq 1290 ISP, which supports camera sensors up to 200MP and features a 17EV dynamic range pipeline. Video capture options include 8K60, 4K60 96dB HDR with content-aware semantic processing, 4K120 with electronic image stabilization (EIS), and 4K native slow motion at 240 fps.
Connectivity and Networking
The integrated modem supports 3GPP Release 17 standards across Sub-6GHz (FR1) 5G and legacy cellular networks. Key features include 5-carrier aggregation (5CC, up to 350MHz bandwidth) on downlinks, 2-carrier aggregation (2CC, up to 200MHz bandwidth) on uplinks, and 5G/4G Triple SIM Triple Active (TSTA) functionality.
Wireless local connectivity features Wi-Fi 7 with Triple Band Triple Concurrency (TBTC) reaching speeds up to 7.3 Gbps, as well as Bluetooth 6.2 powered by a dual Bluetooth engine supporting throughput up to 12 Mbps. Location tracking covers all major constellations across dual- and multi-frequency bands, including GPS, BeiDou, GLONASS, Galileo, QZSS, and NavIC.
Hardware Specifications
| Component | MediaTek Dimensity 9600 Pro Specification |
| Process Node |
2nm |
| CPU Architecture | 8-core (2+3+3): 2x Arm C2-Ultra (4.55 GHz) + 3x Arm C2-Pro (4.35 GHz) + 3x Arm C2-Pro (3.1 GHz) |
| CPU Cache | 2x 2MB L2 + 3x 1MB L2 + 3x 512KB L2, 16MB L3 cache, 10MB SLC (34.5MB total) |
| Memory | LPDDR6 10667 / LPDDR5X 10667 |
| Storage | UFS 5.0 |
| NPU |
Dual NPU: MediaTek NPU 1090 + Super Efficient NPU 2.0 |
| GPU |
Arm Mali-G2 Ultra NX |
| Display Support |
Up to WQHD+ at 180Hz; Tri-port MIPI for tri-fold displays; Rec. 2020 color pipeline |
| Camera (ISP) |
Up to 200MP sensor; Imagiq 1290; 17EV HDR |
| Video Capture |
8K at 60fps, 4K at 60fps HDR, 4K at 120fps (EIS), 4K at 240fps slow-motion |
| Video Playback |
8K at 60fps 10-bit decode (VVC, HEVC, AVC, VP9, AV1); 8K at 60fps 8-bit encode (HEVC) |
| Cellular Modem | 3GPP Release 17 5G Sub-6GHz, 5CC DL (350MHz), 2CC UL (200MHz), Triple SIM Triple Active |
| Wireless / BT |
Wi-Fi 7 (up to 7.3 Gbps, TBTC), Bluetooth 6.2 (dual-engine, up to 12 Mbps) |
| GNSS | Multi-band GPS, BeiDou, Glonass, Galileo, QZSS, NavIC |
Dimensity 9600M Companion Platform
MediaTek also previewed the Dimensity 9600M, positioned as a high-performance alternative to the flagship processor. It carries forward the platform’s Agentic AI Engine, the Dimensity Scheduling Engine, display support up to 185 fps, and HyperEngine gaming optimizations. Both platforms are expected to enter the smartphone market over the coming quarter.
MediaTek Dimensity 9600M Specifications
| Component | Specification |
| CPU Configuration |
Octa-core (1+3+4): 1x Arm C1-Ultra (2MB L2 cache), 3x Arm C1-Premium (1MB L2 cache each), 4x Arm C1-Pro (512KB L2 cache each) |
| System Cache | 16MB L3 cache, 10MB System Level Cache |
| Memory | LPDDR5X 10667 |
| Storage | UFS 4.1 (4-lane) |
| AI Processing | MediaTek NPU 990 (Generative AI, Agentic AI) |
| GPU | Arm Mali-G1 Ultra MC12 |
| Display | Up to WQHD+ at 180Hz; Tri-port MIPI for tri-fold displays |
| Camera (ISP) | Up to 320MP sensor |
| Video Capture | 8K at 60fps (7680 x 4320), 4K at 120fps (EIS), 4K at 60fps cinematic mode |
| Video Playback | 8K at 60fps 10-bit decode (HEVC, AVC, VP9, AV1); 8K at 60fps 8-bit encode (HEVC); 8K at 30fps 10-bit encode (HEVC/AVC) |
| Cellular Modem | 3GPP Release 17 Sub-6GHz (FR1); 5CC DL (350MHz); 2CC UL (200MHz); Dual SIM Dual Active (DSDA) |
| Wi-Fi & Bluetooth | Wi-Fi 7 (up to 7.3 Gbps, TBTC); Bluetooth 6.0 with dual Bluetooth engine (up to 12 Mbps) |
| GNSS | GPS (L1CA+L5+L1C), BeiDou (B1I+B1C+B2a+B2b), GLONASS (L1OF), Galileo (E1+E5a+E5b), QZSS (L1CA+L5), NavIC (L5+L1) |
Availability
vivo will be the first company to use the Dimensity 9600 Pro chip in its vivo X500 Pro smartphone, and the vivo X500 will be powered by the Dimensity 9600M SoC. The phones will be introduced on September 21st.
The OPPO Find X10 Pro Max, which will be in the Find X10 series that will be introduced on September 22nd, will also use the Dimensity 9600 Pro chip.