At the 2026 Mobile World Congress (MWC), TECNO will reveal a new smartphone concept based on its Modular Magnetic Interconnection Technology. The TECNO Modular Phone utilizes magnetic attachments and wireless connectivity to allow users to physically expand the device’s hardware capabilities.
The platform is designed as a potential solution to balance the increasing computing demands of artificial intelligence with the physical space constraints of standard mobile devices.
Design and Aesthetics
The TECNO Modular Phone concept features an ultra-thin base device measuring 4.9mm in thickness. The exterior consists of a polished metal frame and a glass back panel treated with a laminated anti-glare finish to create a soft, matte texture.
The rear of the device is visually divided into eight modular zones using subtle lines, which serve as physical guides for aligning and attaching accessories. TECNO has developed two distinct design interpretations for the concept:
- ATOM Edition: Features a silver-aluminum body with red accents, designed around a clean and structured aesthetic.
- MODA Edition: Features a bolder design targeted toward a tech-enthusiast demographic.
The Modular Ecosystem
The platform relies on a system of interchangeable hardware modules. TECNO has developed approximately ten specific modules for the ecosystem’s introduction.
Key modules include:
- Power Bank: An ultra-slim 4.5mm battery pack that doubles the device’s power capacity. When attached to the 4.9mm base phone, the total thickness remains comparable to standard, non-modular smartphones.
- Action Camera: A module designed to provide alternative shooting angles and workflows without significantly increasing the device’s weight.
- Telephoto Lens: A standalone camera system that connects to the phone, utilizing the smartphone’s display as a low-latency viewfinder for live previews and image capture.
Connectivity Architecture
The connection system between the smartphone and the modules utilizes a hybrid architecture to manage both physical attachment and data transfer.
- Physical Attachment and Power: A rectangular magnetic array secures the modules to the phone. Power is delivered through physical pogo-pin connectors, which are utilized to maintain efficiency and reduce heat generation.
- Data Transmission: The system automatically routes data between the phone and the attached module using a combination of Wi-Fi, Bluetooth, and millimeter-wave (mmWave) technology to ensure high bandwidth and low latency depending on the specific accessory’s requirements.
Platform Scalability
TECNO is presenting the Modular Phone as a concept platform to gauge the long-term viability of adaptable hardware. While the current interface is proprietary to TECNO, the underlying physical and connectivity architecture is built to support future expansions.
The company has indicated that the system could eventually accommodate modules for expanded storage, dedicated AI computing tools, and lifestyle accessories, with the potential for broader compatibility outside of the primary TECNO ecosystem in the future.
Regarding the concept phone, Leo Li, TECNO Product Head of Modular Magnetic Interconnection Technology, said:
We believe the ultimate goal of technology is not to create a static masterpiece but to offer an extension of human freedom. By pioneering this modular architecture, we are breaking the constraints of fixed hardware and returning the power of choice to the user. This is more than a leap in connectivity; it is an experiment in mobile liberation, where the device is no longer defined by its factory form but by the user’s intent in every moment.