Qualcomm Technologies has announced a partnership with BOE Technology Group, that will enable collaboration between two companies to develop display products that feature Qualcomm’s 3D Sonic ultrasonic fingerprint sensors. The collaboration will result in technology integration among various fields like mobile, 5G technologies, XR and IoT.
BOE Technology Group is a Chinese-based electronics components producer with industry leading experience in interface devices, smart IoT systems and smart medicine and engineering integration. The partnership between these two companies will help Qualcomm integrate its 3D Sonic sensors onto BOE’s flexible OLED displays, creating new solutions and products. The partnership will also help reduce research and development expenses as it will provide for a streamlined supply chain and reduced bill of materials (BoM).
Commenting on the partnership, Wenbao Gao, executive vice president and chief executive officer of display and sensor, BOE said:
As a global leader in the semiconductor display industry, BOE has always adhered to the IoT strategy of ‘Ecosystem: Open and Connected,’ providing global users with excellent intelligent interface devices and solutions. BOE will start shipping flexible OLED panels with integrated Qualcomm 3D Sonic sensors during the second half of 2020
Roawen Chen, senior vice president and chief operations officer, QCT, Qualcomm Technologies, Inc. said:
Qualcomm Technologies continuously strives to improve our collaboration in China, and collaboration with BOE will be another example of the dedication and our long-term commitment to driving innovations in this vibrant ecosystem. Through this collaboration, we expect that OEMs will have more opportunities to design cutting-edge products that feature OLED displays made with the Qualcomm 3D Sonic fingerprint sensor technology. We look forward to further strengthening our innovative collaborations with BOE in key areas like 5G, XR and IoT