A number of rumors and reports about the upcoming Apple iPhone 8 have already made the rounds on internet. Now, schematics of the iPhone 8 has surfaced hinting again at slimmer bezels and other design changes.
The schematics that were posted on Weibo have been supposedly shared by Foxconn. As per the drawings, iPhone 8 will sport slimmer bezels in the front thereby offering a large display similar to the Samsung Galaxy S8. The top and bottom bezels are also significantly smaller. This year’s iPhone 8 is expected to sport edge-to-edge OLED displays instead of LCD display. Along with the slimmer front panel, the drawings also highlight rear mounted Touch ID fingerprint sensor below the Apple logo. The dual rear camera module along with flash is present vertically in the top-left corner.
Previous reports have stated that Apple is facing design issues with integrating the fingerprint sensor below the display on the iPhone 8 and it is considering to relocate the Touch ID at the back instead. As per the drawings, the iPhone 8 device is measured at 149 mm tall, 72.5 mm wide and 7.1 mm thin. It is suggested that the above image was taken during the third revision of the iPhone 8’s Engineering Validation Test which is an early stage in Apple’s product development cycle. Before this design is finalized, it must also pass a Design Validation Test, and a Production Validation Test.