Qualcomm has announced the expansions of Qualcomm Spectra Module Program, capable of improved biometric authentication and high-resolution depth sensing targeted at mobile devices and head mounted displays (HMD). This will use next-generation Qualcomm Spectra ISP and camera modules. Continue reading “Qualcomm Spectra depth sensing camera tech for Android announced”
Reliance Jio unveiled its first 4G VoLTE feature phone – JioPhone yesterday. The company revealed some of the features of the phone, but it did not confirm complete specifications at the event or on its site. Today Qualcomm India confirmed that the phone is powered by its latest 205 Mobile Platform which is a 1.1GHz Dual Core SoC with integrated X5 LTE Global Mode modem for VoLTE and multimode dual SIM. The Lava 4G Connect M1, which was the launched as the first VoLTE feature phone is powered by a Quad-core Spreadtrum SP9820A Processor.
Continue reading “JioPhone is powered by Qualcomm 205 Mobile Platform”
Intel has accused Qualcomm of creating a monopoly for itself and not licensing “standard-essential” patents at a fair rate as required by law. The statement, filed with the US International Trade Commission (ITC) comes in response to Qualcomm’s suit against Apple alleging that the iPhone maker was infringing on six patents that aided iPhone battery life. Continue reading “Intel accuses Qualcomm’s anti-competitive actions for mobile chips”
Qualcomm has filed a suit against Apple alleging that the latter was infringing on six patents that aided iPhone battery life. The chip maker is seeking a ban on imports and sale of some models iPhone in the US. Continue reading “Qualcomm sues Apple over patent infringement; seeks iPhone import ban”
In an attempt to improve the mobile experience and usage, Qualcomm earlier this year unveiled integrated 2×2 802.11ac Wi-Fi with MU-MIMO solutions for Qualcomm’s recent mobile platforms. Now the company has announced that over 100 device designs from leading device OEMs in China and around the world are currently leveraging the technology. Continue reading “Qualcomm announces traction for its integrated 2×2 802.11ac Wi-Fi with MU-MIMO solutions”
Qualcomm has announced the Snapdragon Wear 1200 chipset at MWC Shanghai. The Snapdragon Wear 1200 comes with built-in LTE and is aimed at entry level wearable and IoT devices. It is targeted at activity trackers for kids, pets and more.
Continue reading “Qualcomm announces Snapdragon Wear 1200 with built-in LTE for wearables and IoT”
After Qualcomm introduced its next-gen fingerprint scanning solution, Vivo has announced its Under Display Fingerprint Scanning Solution called Vivo Under Display that offers under-display fingerprint scanning. The company demoed it for the first time at the MWC 2017 Shanghai on a prototype and will be used it its future smartphone. This can be used under the screen, behind the metal shell, or even in the frame. Continue reading “Vivo shows off Under Display Ultrasonic Fingerprint Scanning solution”
Qualcomm has announced new Fingerprint Sensors, next-generation ultrasonic fingerprint solutions at the Mobile World Congress Shanghai 2017. This consists of sensors for Display, Glass and Metal, detection of directional gestures, and underwater fingerprint match and device wake-up. The ultrasonic-based mobile solution can also detect heart beat and blood flow for improved mobile authentication experiences, making to first in the world to be announced wit the feature. Qualcomm’s Sense ID ultrasonic fingerprint sensor is used in last year’s Xiaomi Mi 5s. Continue reading “Qualcomm’s next-gen fingerprint sensors can scan through display or metal, work underwater and detect heart beat”
Qualcomm at the Mobile World Congress Shanghai 2017 introduced the Qualcomm Snapdragon 450 Mobile Platform successor of last year’s Snapdragon 435 that is being used in several budget 4G smartphones, including the Xiaomi Redmi 4 . Targeted at mid-range smartphones and tablets, this is the first one in the Snapdragon 400 series that is based on 14nm FinFET process and has up to 1.8GHz ARM Cortex A53 cores and Adreno 506 GPU promising 25% increase in compute performance and graphics performance compared to the predecessor. It also has USB 3.0 support, Quick Charge 3.0, Snapdragon X9 LTE modem and 802.11ac with MU-MIMO support.
Continue reading “Qualcomm Snapdragon 450 14nm Octa-Core Mobile Platform with X9 LTE modem announced”
Qualcomm at its voice and music developer conference today announced new audio system-on-chip (SoCs) platforms. Qualcomm Smart Audio Platform Combines Premium Audio Solutions, Advanced Far-Field Voice Capture, Wake-Word Detection, Qualcomm AllPlay Multi-Room Audio Technology, and Support for Voice Assistants to Help Innovative Voice Interactions
Continue reading “Qualcomm announces new audio platforms for next-gen wireless speakers and headphones, USB Type-C headsets”
Last month at the Computex 2017 Qualcomm announced that ASUS, HP and Lenovo will be the first OEM to develop mobile PCs powered by the ARM-based Qualcomm Snapdragon 835 Mobile PC Platform with X16 LTE modem. This came after Microsoft failed to bring Windows to ARM chips in the form of Windows RT with Surface with Windows RT and Nokia Lumia 2520. Continue reading “Intel hints at potential patent infringement by Qualcomm and Microsoft over Windows on ARM’s x86 emulation”
Qualcomm introduced Quick Charge 4 last year along with the Snapdragon 835 Mobile Platform. Now it has announced Quick Charge 4+ that includes all the benefits of Quick Charge 4 along with three new enhancements such as improved Dual Charge, Intelligent Thermal Balancing and Advanced Safety Features. With these features it can charge up to 15 percent faster, or 30 percent more efficiently when compared to Quick Charge 4, says Qualcomm.
Continue reading “Qualcomm Quick Charge 4+ announced, can charge devices up to 15% faster, 30% more efficiently compared to Quick Charge 4”
At the WinHEC event in Shenzhen, China last December, Microsoft and Qualcomm announced that Windows 10 will be coming to next-generation of Snapdragon mobile processors. Today, at the Computex 2017 Qualcomm announced that ASUS, HP and Lenovo will be the first OEM to develop mobile PCs powered by the Qualcomm Snapdragon 835 Mobile PC Platform with X16 LTE modem. Continue reading “ASUS, HP and Lenovo to build Windows 10 PCs with LTE powered by Snapdragon 835”
Qualcomm has announced Mesh Networking Platform that allows original equipment manufacturers (OEM) and broadband carriers to deliver next-generation “connected” home experiences. It is based upon the Qualcomm IPQ40x8/9 network system-on-chip, which is used in nearly every mesh networking product available today. Continue reading “Qualcomm unveils Mesh Networking Platform for connected devices”
OnePlus and Qualcomm are partnering again for the OnePlus 5. As the launch OnePlus’ next flagship is near, both these companies today confirmed that the smartphone will be powered by Snapdragon 835 Mobile Platform. With the OnePlus 5, the company not only aims to offer smooth performance, it is also keen to fix touch latency issues that had been one of the main complaints with the OnePlus 3 and OnePlus 3T smartphones.
Continue reading “OnePlus 5 will be powered by Snapdragon 835”