In an attempt to improve the mobile experience and usage, Qualcomm earlier this year unveiled integrated 2×2 802.11ac Wi-Fi with MU-MIMO solutions for Qualcomm’s recent mobile platforms. Now the company has announced that over 100 device designs from leading device OEMs in China and around the world are currently leveraging the technology. Continue reading “Qualcomm announces traction for its integrated 2×2 802.11ac Wi-Fi with MU-MIMO solutions”
Qualcomm has announced the Snapdragon Wear 1200 chipset at MWC Shanghai. The Snapdragon Wear 1200 comes with built-in LTE and is aimed at entry level wearable and IoT devices. It is targeted at activity trackers for kids, pets and more.
Continue reading “Qualcomm announces Snapdragon Wear 1200 with built-in LTE for wearables and IoT”
After Qualcomm introduced its next-gen fingerprint scanning solution, Vivo has announced its Under Display Fingerprint Scanning Solution called Vivo Under Display that offers under-display fingerprint scanning. The company demoed it for the first time at the MWC 2017 Shanghai on a prototype and will be used it its future smartphone. This can be used under the screen, behind the metal shell, or even in the frame. Continue reading “Vivo shows off Under Display Ultrasonic Fingerprint Scanning solution”
Qualcomm has announced new Fingerprint Sensors, next-generation ultrasonic fingerprint solutions at the Mobile World Congress Shanghai 2017. This consists of sensors for Display, Glass and Metal, detection of directional gestures, and underwater fingerprint match and device wake-up. The ultrasonic-based mobile solution can also detect heart beat and blood flow for improved mobile authentication experiences, making to first in the world to be announced wit the feature. Qualcomm’s Sense ID ultrasonic fingerprint sensor is used in last year’s Xiaomi Mi 5s. Continue reading “Qualcomm’s next-gen fingerprint sensors can scan through display or metal, work underwater and detect heart beat”
Qualcomm at the Mobile World Congress Shanghai 2017 introduced the Qualcomm Snapdragon 450 Mobile Platform successor of last year’s Snapdragon 435 that is being used in several budget 4G smartphones, including the Xiaomi Redmi 4 . Targeted at mid-range smartphones and tablets, this is the first one in the Snapdragon 400 series that is based on 14nm FinFET process and has up to 1.8GHz ARM Cortex A53 cores and Adreno 506 GPU promising 25% increase in compute performance and graphics performance compared to the predecessor. It also has USB 3.0 support, Quick Charge 3.0, Snapdragon X9 LTE modem and 802.11ac with MU-MIMO support.
Continue reading “Qualcomm Snapdragon 450 14nm Octa-Core Mobile Platform with X9 LTE modem announced”
Qualcomm at its voice and music developer conference today announced new audio system-on-chip (SoCs) platforms. Qualcomm Smart Audio Platform Combines Premium Audio Solutions, Advanced Far-Field Voice Capture, Wake-Word Detection, Qualcomm AllPlay Multi-Room Audio Technology, and Support for Voice Assistants to Help Innovative Voice Interactions
Continue reading “Qualcomm announces new audio platforms for next-gen wireless speakers and headphones, USB Type-C headsets”
Last month at the Computex 2017 Qualcomm announced that ASUS, HP and Lenovo will be the first OEM to develop mobile PCs powered by the ARM-based Qualcomm Snapdragon 835 Mobile PC Platform with X16 LTE modem. This came after Microsoft failed to bring Windows to ARM chips in the form of Windows RT with Surface with Windows RT and Nokia Lumia 2520. Continue reading “Intel hints at potential patent infringement by Qualcomm and Microsoft over Windows on ARM’s x86 emulation”
Qualcomm introduced Quick Charge 4 last year along with the Snapdragon 835 Mobile Platform. Now it has announced Quick Charge 4+ that includes all the benefits of Quick Charge 4 along with three new enhancements such as improved Dual Charge, Intelligent Thermal Balancing and Advanced Safety Features. With these features it can charge up to 15 percent faster, or 30 percent more efficiently when compared to Quick Charge 4, says Qualcomm.
Continue reading “Qualcomm Quick Charge 4+ announced, can charge devices up to 15% faster, 30% more efficiently compared to Quick Charge 4”
At the WinHEC event in Shenzhen, China last December, Microsoft and Qualcomm announced that Windows 10 will be coming to next-generation of Snapdragon mobile processors. Today, at the Computex 2017 Qualcomm announced that ASUS, HP and Lenovo will be the first OEM to develop mobile PCs powered by the Qualcomm Snapdragon 835 Mobile PC Platform with X16 LTE modem. Continue reading “ASUS, HP and Lenovo to build Windows 10 PCs with LTE powered by Snapdragon 835”
Qualcomm has announced Mesh Networking Platform that allows original equipment manufacturers (OEM) and broadband carriers to deliver next-generation “connected” home experiences. It is based upon the Qualcomm IPQ40x8/9 network system-on-chip, which is used in nearly every mesh networking product available today. Continue reading “Qualcomm unveils Mesh Networking Platform for connected devices”
OnePlus and Qualcomm are partnering again for the OnePlus 5. As the launch OnePlus’ next flagship is near, both these companies today confirmed that the smartphone will be powered by Snapdragon 835 Mobile Platform. With the OnePlus 5, the company not only aims to offer smooth performance, it is also keen to fix touch latency issues that had been one of the main complaints with the OnePlus 3 and OnePlus 3T smartphones.
Continue reading “OnePlus 5 will be powered by Snapdragon 835”
Qualcomm has announced that it is currently shipping more than 1 million chips per day for Internet of Things (IoT) devices. It also said that brands have shipped over 1.5 billion IoT products using Qualcomm Technologies’ Products, which is a new milestone. Continue reading “Qualcomm is shipping over 1 million chips per day for IoT devices”
Qualcomm has demoed dynamic electric vehicle charging (DEVC), which allows vehicles to charge while driving. This is based on the Qualcomm Halo wireless electric vehicle charging technology (WEVC). Qualcomm said that it has designed and built a wireless DEVC system capable of charging an electric vehicle (EV) dynamically at up to 20 kilowatts at highway speeds and in excess of, 100 km/h. Continue reading “Qualcomm demos dynamic electric charging tech to charge vehicles while driving”
Google at the Google I/O 2017 announced its standalone Daydream VR headset, as expected. HTC’s VIVE and Lenovo will be building these headsets that are coming later this year. Google will also create a standalone headset reference design powered by the Qualcomm Snapdragon 835 VR platform. Since it is an untethered headset that doesn’t require a smartphone like the first generation Daydream headset, and this comes with positional head-tracking.
Continue reading “HTC VIVE and Lenovo are developing standalone Google Daydream VR Headsets”
Earlier in January this year US Federal Trade Commission (FTC) filed a lawsuit against Qualcomm for anti-competitive practices. Now, Intel and Samsung have filed amicus briefs with the court supporting the FTC’s lawsuit and opposing Qualcomm’s request to dismiss the case. Both the companies claim that Qualcomm uses its dominant position in the mobile processor industry to keep other players out. Continue reading “Intel and Samsung file amicus brief to support FTC lawsuit against Qualcomm”